Resin composition and application thereof

A technology of resin composition and epoxy resin, which is applied in the field of laminates, can solve the problems of improving film elongation, peel strength, and low CTE, and achieve the effects of avoiding reliability influence, good elongation, and small average particle size

Active Publication Date: 2021-11-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above prior art cannot effectively solve the problem of improving the elongation of the adhesive film and the peel strength. Therefore, in the present invention, it is expected to develop a method that can make the adhesive film and resin-coated copper foil have better elongation and higher Resin composition with excellent peel strength, low CTE, and low Df

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] First dissolve 40 parts of epoxy resin (NC-3000H) and 30 parts of phenolic resin (SN-485) with an appropriate amount of solvent, and stir for more than 2 hours.

[0057] Then add 30 parts of silicon dioxide 3 (D50 is 0.5 μm, D100:D10 is 2.0, and the purity is 99.90%) obtained by organosilicon hydrolysis, and continue to stir for more than 4 hours, and mix well to form a solid content of 65%. solution.

[0058] The above solution was coated on the release film, and after drying, it was baked in an oven at 120°C for 3 minutes to obtain an adhesive film of a semi-cured resin layer. Press and cure the semi-cured adhesive film (thickness 40 μm) and the browned PCB board, tear off the release film and then perform surface treatment, copper electroplating, to form a laminated printed circuit board with lines.

Embodiment 2

[0060] Except changing the ratio of silicon dioxide synthesized by the chemical method used in Example 1, the same method as in Example 1 was used to manufacture the adhesive film.

[0061] First dissolve 23 parts of epoxy resin (NC-3000H) and 17 parts of phenolic resin (SN-485) with an appropriate amount of solvent, and stir for more than 2 hours.

[0062] Then add 60 parts of silicon dioxide 3 (D50 is 0.5 μm, D100:D10 is 2.0, and the purity is 99.90%) obtained by organosilicon hydrolysis, and continue to stir for more than 4 hours, and mix well to form a solid content of 65%. solution.

[0063] The above solution was coated on the release film, and after drying, it was baked in an oven at 120°C for 3 minutes to obtain an adhesive film of a semi-cured resin layer. Press and cure the semi-cured adhesive film (thickness 40 μm) and the browned PCB board, tear off the release film and then perform surface treatment, copper electroplating, to form a laminated printed circuit boar...

Embodiment 3

[0065] First dissolve 30 parts of epoxy resin (NC-3000H) and 25 parts of phenolic resin (SN-485) with an appropriate amount of solvent, and stir for more than 2 hours.

[0066] Then add 45 parts of silicon dioxide 2 (D50 is 0.1 μm, D100:D10 is 2.3, and the purity is 99.90%) obtained by organosilicon hydrolysis, and continue to stir for more than 4 hours, and mix well to form a solid content of 65%. solution.

[0067] The above solution was coated on the release film, and after drying, it was baked in an oven at 120°C for 3 minutes to obtain an adhesive film of a semi-cured resin layer. Press and cure the semi-cured adhesive film (thickness 40 μm) and the browned PCB board, tear off the release film and then perform surface treatment, copper electroplating, to form a laminated printed circuit board with lines.

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Abstract

The invention provides a resin composition and application thereof. The resin composition comprises the following components in percentage by weight: 40-70% of crosslinkable and curable resin and 30-60% of afiller, and the filler is silicon dioxide prepared by an organic silicon hydrolysis method, the average particle size D50 of the silicon dioxide is 0.1-3 microns, and the ratio of the particle size D100 to the particle size D10 of the silicon dioxide is less than or equal to 2.5. According to the composition disclosed by the invention, the prepared adhesive film and the resin-coated copper foil have higher elongation rate, higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. Th resin composition can realize thinner circuit processing capability, and can be applied to a multi-layer laminated board, in particular to a printed circuit board material of a thin-circuit multi-layer laminated board.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a resin composition and its application. Background technique [0002] As the future of electronic information products is mainly towards the design trend of light, thin, small and multi-functional, the printed circuit substrate, which is the main support of electronic components, will also continue to improve its technical level to provide high-density wiring, thin shape, micro-aperture, multi-dimensional etc. The substrate material determines the performance of the printed circuit substrate to a large extent, so it is urgent to develop a new generation of substrate materials. [0003] Adhesive film without reinforcing material or resin-coated copper foil is developed and applied as a new generation of substrate materials because it can achieve thinner shape, high-density wiring, micro-aperture, multi-dimensional three-dimensional molding, etc. Since there is no reinfor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08L79/04C08L79/08C08L71/12C08K3/36B32B15/20B32B15/14B32B17/02B32B27/04
CPCC08L63/00C08L79/04C08L71/12B32B15/20B32B15/14B32B5/02C08K2201/003B32B2262/101B32B2260/021B32B2260/046B32B2457/08C08L61/06C08K3/36C08L79/085
Inventor 汪青刘潜发刘东亮董晋超柴颂刚许永静张艳华
Owner GUANGDONG SHENGYI SCI TECH
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