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A kind of preparation method of micro-nano metal particle surface coating

A metal particle, micro-nano technology, applied in the field of surface engineering, can solve the problems of growing on the cathode and difficult to form a coating, and achieve the effects of high material utilization, good high temperature performance and high electroplating efficiency

Active Publication Date: 2022-07-05
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that it is difficult to form a coating on the surface of the existing micro-nano metal particles, and to provide a method for preparing a coating on the surface of the micro-nano metal particles. Form a coating on the surface of the metal particles to improve the utilization of the plating solution; control the flow rate of the plating solution to flush the cathode to avoid the phenomenon of metal particles growing on the cathode; introduce multiple pairs of electrodes into the fluid system to improve the efficiency of electroplating

Method used

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  • A kind of preparation method of micro-nano metal particle surface coating
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  • A kind of preparation method of micro-nano metal particle surface coating

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specific Embodiment approach 1

[0029] Embodiment 1: This embodiment describes a method for preparing a coating on the surface of micro-nano metal particles. The specific steps of the method are as follows:

[0030] Step 1: Select the micro-nano metal particles to be electroplated, and remove the oxide film on the surface;

[0031] Step 2: Select and configure the plating solution to be electroplated, select and make the electrode for electroplating;

[0032] Step 3: mixing the micro-nano metal particles obtained in step 1 with the plating solution in step 2 to prevent the micro-nano metal particles from being oxidized in the air;

[0033] Step 4: Assemble an electroplating device, the electroplating device specifically includes an electroplating tank, a microfluidic tube, a micropump and a power supply; the microfluidic tube includes a vertical section and a transition section, such as figure 2 The vertical section is equipped with a plurality of pairs of electrodes for electroplating and the lead wires o...

specific Embodiment approach 2

[0042] Embodiment 2: In the method for preparing the surface coating of micro-nano metal particles described in Embodiment 1, in step 1, the micro-nano metal particles to be electroplated are spherical particles with a diameter of 50 nm to 10 μm, and the material is Copper and other micro-nano metal particles with good electrical conductivity.

specific Embodiment approach 3

[0043] Embodiment 3: In the method for preparing a coating on the surface of micro-nano metal particles described in Embodiment 1, during the circulation process of the plating solution, it is necessary to ensure that the plating solution is kept in a continuous state without bubbles in the microfluidic tube.

[0044] Embodiment 4: The method for preparing a coating on the surface of micro-nano metal particles described in Embodiment 1. In step 8, the flow rate of the plating solution in the microfluidic tube is 0.1 m / s. The nano-metal particles stay in the cathode for a short time to complete the electroplating, and due to the scouring of the water flow, the micro-nano metal particles will not grow on the surface of the cathode and enter the plating solution.

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Abstract

The invention discloses a preparation method for the surface coating of micro-nano metal particles, belonging to the field of surface engineering. The method is as follows: selecting and configuring a plating solution for electroplating, selecting the micro-nano metal particles to be electroplated, removing the surface oxide film on the selected micro-nano metal particles, mixing with the weakly acidic plating solution and adding it into the electroplating tank, and then electroplating. Add a magnetic rotor to the tank to stir the electroplating solution, so that the micro-nano metal particles are evenly dispersed in the electroplating solution, and the stirring does not stop during the electroplating process, turn on the power supply of the micropump, make the electroplating solution circulate stably in the microtube, turn on the electroplating power supply, and conduct electroplating After a certain period of time, the electroplating is completed, and the electroplated plating solution is centrifuged and dried to obtain micro-nano metal particles with good plating. The invention can be applied to solder balls in the field of electronic packaging such as flip chip bonding and ball grid array packaging, and has the advantages of low resistance, strong signal transmission capability, strong electromigration resistance and creep resistance.

Description

technical field [0001] The invention belongs to the field of surface engineering, and in particular relates to a preparation method of a surface coating of micro-nano metal particles. Background technique [0002] With the continuous development and innovation of electronic packaging technology, the density of integrated circuits (IC, Integrated Circuit) is getting higher and higher. The emergence of technologies such as Flip Chip (Flip Chip) and Ball Grid Array Package (BGA, Ball Grid Array Package) makes IC integration density and performance are further improved. Most of the high-density electronic packaging technologies include the process of implanting the balls, that is, the solder balls that play the role of connecting and transmitting signals are implanted into the pad positions. These solder balls are the most prone to failure, so their performance requirements are more stringent. For example, metal copper has the advantages of low resistance, strong signal transm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/00C25D5/08C25D3/48C25D3/12
CPCC25D7/006C25D7/00C25D5/08C25D3/12C25D3/48
Inventor 郑振张茜琳龚耀龙刘威孔令超
Owner HARBIN INST OF TECH
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