Silicon wafer pickup device

Abstract

The invention provides a silicon wafer pickup device. Under the condition that the thickness of a wafer fork body is very limited (thinner), a first gas path channel is arranged in the middle area of the wafer fork body and is used for providing Bernoulli adsorption force to adsorb a silicon wafer, a second gas path channel is arranged around the first gas path channel, and the second gas path channel is arranged in a narrow space of the wafer fork body; and the second gas path channel is connected with a vacuum air source and is used as a negative pressure suction channel or a vacuum channel. When an anti-skid gasket (such as a flexible gasket) which easily generates particles is adopted subsequently, the second gas path channel is used as a negative pressure channel to suck the particles, so that the particles in the silicon wafer pickup working process are effectively reduced, and the granularity of a silicon wafer product reaches the standard. When an anti-skid gasket (such as a hard gasket) which does not easily generate particles is adopted subsequently, the second gas path channel is used as a vacuum channel, and the silicon wafer is adsorbed under the assistance of vacuum, so that the silicon wafer is prevented from sliding in the horizontal direction during carrying.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a silicon wafer pick-up device. Background technique [0002] With the improvement of the automation of IC equipment, the silicon wafer pick-up device (silicon wafer manipulator) has become an indispensable key device in many semiconductor processing processes such as polishing, etching, assembly, and packaging. The silicon wafer pick-up device often adopts the Bernoulli principle to absorb the silicon wafer, so it is also called the Bernoulli manipulator, which is used for the adsorption and transmission of the silicon wafer. When working, the fork body of the silicon wafer pick-up device moves above the silicon wafer, and compressed air is blown out through the air groove in the fork body to provide Bernoulli adsorption force so that the silicon wafer is adsorbed on the fork body and then transported. The fork body is relatively thin, but t...

AI Technical Summary

Problems solved by technology

[0007]Another object of the present invention is to solve the problem that the frictional force that exists when using an anti-slip pad that is not easy to produce particles becomes smaller, and silicon wafers tend to slide horizontally during transportation The problem

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