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Needling type die bonder

A die-bonding machine and acupuncture technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as low transfer efficiency of LED wafers, and achieve the goal of reducing transfer steps, reducing manufacturing costs, and improving transfer efficiency. Effect

Pending Publication Date: 2021-10-22
SHEN ZHEN TALUER TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a needle-punched crystal bonder to solve the technical problem of low efficiency in the transfer of LED chips by the crystal bonder in the prior art

Method used

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Embodiment Construction

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] The die bonding machine in the prior art includes: a wafer tray 3 for carrying a wafer, a stage 4 for carrying a substrate 5, a needle punching device 16 and a suction nozzle, wherein the wafer tray 3 and the stage 4 are in the same position. On a horizontal plane, the needling device 16 is arranged below the wafer disc 3. During work,...

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Abstract

The invention relates to the technical field of die bonding, in particular to a needling type die bonder which comprises a base, wherein a needling device is arranged above the base through a first gantry assembly, and the needling device is provided with a plurality of needling heads; a wafer disc which is used for bearing a wafer and is movably mounted below the plurality of needling heads through a first linear driving mechanism; a carrying table, which is used for carrying a substrate and is movably mounted below the wafer disc through a second linear driving mechanism, so that any one of the needling heads, an LED wafer in the wafer and a wafer fixing point in the substrate are located on the same straight line. In conclusion, by adopting the design of the invention, on one hand, the manufacturing cost can be reduced and the transfer steps can be reduced by omitting the structure of a suction nozzle, and on the other hand, the transfer of a plurality of LED wafers can be realized at one time through the design of a plurality of needling heads, so that the transfer efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of crystal bonding, in particular to an acupuncture type crystal bonding machine. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a luminous element capable of converting electrical energy into light energy. With the development of light-emitting diode (LED) technology, light-emitting diodes are widely used in daily life fields such as lighting and signal display, and LED manufacturing technology such as die-bonding technology is also developing continuously. [0003] LED chips are usually glued on the blue film by the suppliers to form a wafer. The die bonding machine in the prior art includes: a wafer tray for carrying the wafer, a stage for carrying the substrate, a needle punching device, and a suction Nozzle, wherein the wafer disc and the carrier are on the same level, and the acupuncture device is set under the wafer disc. When working, first use the acupuncture he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L33/48
CPCH01L33/48H01L21/68742H01L2933/0033
Inventor 邓应铖曾逸
Owner SHEN ZHEN TALUER TECH CO LTD
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