High speed puncher interlinked precise roll-to-roll material flexible circuit board manufacturing method

Abstract

The present invention relates to a high speed puncher interlinked precise roll-to-roll material flexible circuit board manufacturing method. The method comprises: a first high speed punching step of laminating a transparent roll-to-roll removal film with a blue roll-to-roll removal film, and regularly forming standardized guide holes on both side edge portions of the width direction of the roll-to-roll material removed by rapidly punching a primary shape of a product; a second high speed punching step of laminating a polyimide film on the roll-to-roll material, produced in the first high speed punching step, by a hot melted adhesive and rapidly punching and removing a patterned terminal shape; and a pattern etching step of thermally laminating the roll-to-roll material, produced in the second high speed punching step, with a metal layer, again thermally laminating an exposure film thereon, exposing, developing and etching a fine and precise pattern, separating unnecessary portions, performing a washing operation and a drying operation, then marking defected portions when the pattern is inspected.

Description

technical field [0001] The present invention relates to a method for manufacturing a high-speed punching machine-linked precision roll-to-roll material flexible circuit board. A high-speed punching machine that removes unnecessary parts of flexible printed circuit boards (FPCBs) that are parts of small products such as mobile phones is linked to repeatedly form fine lines on continuous roll-shaped flexible printed circuit boards very precisely without errors. The circuit pattern can be easily mass-produced without causing defects under the condition of low production cost, and the pattern will not be disconnected even if it is impacted by a drop or the like. Background technique [0002] Recently, various electronic devices including mobile phones (portable terminals) for mobile communication have become smaller and lighter. [0003] On the other hand, flexible printed circuit boards or flexible circuit boards are electronic components developed with the miniaturization and...

AI Technical Summary

Problems solved by technology

[0011] Although the prior art has the advantage of producing multi-layer flexible circuit boards through a simple manufacturing process, it still has the problem of being unable to produce precise, high-speed, mass-produced fine patterns at low production costs

[0012] On the other hand, in the existing flexible printed circuit board production system, due to the hard raw material (hard), when the pattern is formed on the curved surface, the pattern is easily separated, detached, etc., which consumes a lot of production costs.

[0013] In addition, in the conventional metal foil antenna (MFA, metal foil antenna) method, since the extrusion die is used to form the pattern, it is difficult to express a fine pattern, it costs a lot of mold costs, and it is difficult to achieve pattern deformation, which consumes a lot of energy. initial development cost

[0014] In addition, in the laser marking antenna (LMA, laser marking antenna) method, the method of gold plating after laser marking is adopted, and when an impact is applied due to the fall of the finished product, etc., the injection molded product will be cracked and the pattern will be damaged. disconnect

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