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Preparation method of nano- silver powder with high sintering activity

A technology of nano-silver powder and sintering activity is applied in the field of preparation of nano-silver powder with high sintering activity, which can solve the problems of inability to sinter the nano-silver with stable properties and the like.

Active Publication Date: 2021-09-14
深圳市宏博信息科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] For this reason, the present invention provides a kind of preparation method of nano-silver powder with high sintering activity, which can solve the technical problem that the properties of sintered nano-silver cannot be stabilized by controlling the particle size of nano-silver

Method used

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  • Preparation method of nano- silver powder with high sintering activity
  • Preparation method of nano- silver powder with high sintering activity
  • Preparation method of nano- silver powder with high sintering activity

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Embodiment Construction

[0043] In order to make the objects and advantages of the present invention clearer, the present invention will be further described below in conjunction with the examples; it should be understood that the specific examples described here are only for explaining the present invention, and are not intended to limit the present invention.

[0044] Preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present invention, and are not intended to limit the protection scope of the present invention.

[0045] It should be noted that, in the description of the present invention, terms such as "upper", "lower", "left", "right", "inner", "outer" and other indicated directions or positional relationships are based on the terms shown in the accompanying drawings. The direction or positional relationship shown is ...

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Abstract

The invention relates to a preparation method of nano-silver powder with high sintering activity, the preparation method comprises the following steps that S1, nano-silver is injected into a first grinding device through a feed port of the first grinding device for primary grinding; S2, the nano-silver subjected to primary grinding is injected into a second grinding device through a feeding port of the second grinding device and is ground again through high-pressure airflow, and the nano-silver meeting the particle size is injected into a sintering device through a discharging port of the second grinding device; and S3, a central control unit controls the sintering device to sinter the nano-silver. The central control unit is arranged, the produced sintered nano-silver meets the preset standard according to the obtained particle size reject ratio of the nano-silver, the volume change rate during sintering, the sintering temperature and the sintering time, meanwhile, the jet flow frequency, the grinding time of the first grinding device and the power parameters of a power device are adjusted, and therefore, the particle size of the love nano-silver meets the preset standard.

Description

technical field [0001] The invention relates to the field of nano silver preparation, in particular to a preparation method of nano silver powder with high sintering activity. Background technique [0002] In the field of microelectronic packaging, the third-generation semiconductor materials represented by SiC and GaN have unique properties such as large band gap, high breakdown voltage, high thermal conductivity, and good chemical stability, making them suitable for use in optoelectronic devices, high In the field of printed electronics, ink printing technology has been widely used in many fields such as solar cells 111121, organic LEDII31, organic thin film transistors 1141 and wearable electronic devices 1151. In recent years, there have been many researches on the application of nano silver particles in the field of microelectronic packaging or printed electronics technology. High, can overcome the defects of traditional solder interconnection, but at present, because ...

Claims

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Application Information

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IPC IPC(8): B22F9/04B22F3/10B22F1/00
CPCB22F9/04B22F3/10B22F2009/041B22F2301/255
Inventor 邢家辉黄毓桦
Owner 深圳市宏博信息科技有限公司
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