A dual-frequency dual-polarization tr module

A dual-polarization, radio-frequency technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, circuit layout on the support structure, etc., can solve the problems of low integration, achieve strong reworkability, reduce assembly difficulty, and ensure sealing The effect of weld strength

Active Publication Date: 2021-09-28
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is equivalent to the accumulation of traditional brick-type TR modules, and the integration level is not high

Method used

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  • A dual-frequency dual-polarization tr module
  • A dual-frequency dual-polarization tr module
  • A dual-frequency dual-polarization tr module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment discloses a dual-frequency dual-polarization TR module (hereinafter referred to as the TR module). The TR module includes a first radio frequency processing module, a second radio frequency processing module, a first sub-board and a second sub-board; the first radio frequency processing module and the second radio frequency processing module are connected back to back; the first radio frequency processing module and the second radio frequency processing module All are airtight. The first sub-board is connected under the first radio frequency processing module, the second sub-board is connected under the second radio frequency processing module, the first sub-board and the second sub-board are interconnected, and the first sub-board or the second sub-board is connected from the bottom Power supply and control signal (it can be that the first sub-board accesses the power supply signal, the second sub-board accesses the control signal, or the two are interc...

Embodiment 2

[0037] This embodiment discloses a dual-frequency dual-polarization TR module (hereinafter referred to as the TR module). The TR module includes upper and lower chambers. The first radio frequency processing module and the second radio frequency processing module are arranged back to back in the upper cavity. The first chipset, the first radio frequency power supply board, the first power distribution microstrip, the second chipset, the second radio frequency power supply board and the second power distribution microstrip are arranged in the upper cavity. The first chipset is interconnected through the first power-dividing microstrip, the first radio frequency power supply board is provided with a first through hole at a position corresponding to the first chipset, and the first chipset is bonded to the first through hole with a gold wire. The second chip group is interconnected through the second power-dividing microstrip, and the second radio frequency power supply board is...

Embodiment 3

[0042] This embodiment discloses a dual-frequency dual-polarization TR module (hereinafter referred to as the TR module) by taking Ka frequency band and Ku frequency band as examples. Such as Figure 1~5 As shown, the TR module includes a cavity body, and the cavity body includes an upper cavity and a lower cavity connected to each other.

[0043] The upper cavity includes a first side and a second side opposite to the left and right, the first side and the second side are both open, and the openings of the two are opposite to each other, there is a partition between the first side and the second side, and the first side is open. The mouth is sealed by a Ku cover 13 and the second side opening is sealed by a Ka cover 23. A Ku chipset 113 and a Ku power distribution microstrip 114 are arranged on the surface of the first side of the upper cavity, and the Ku chipset 113 is interconnected through the Ku centimeter microstrip 114 . The Ka chipset and the Ka cm microstrip 212 are...

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PUM

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Abstract

The invention discloses a dual-frequency dual-polarization TR module, which includes a first radio frequency processing module, a second radio frequency processing module, a first sub-board and a second sub-board; the first radio frequency processing module and the second radio frequency processing module are connected back to back ; Both the first radio frequency processing module and the second radio frequency processing module are airtightly processed. The first sub-board is connected under the first radio frequency processing module, the second sub-board is connected under the second radio frequency processing module, the first sub-board and the second sub-board are interconnected, and the first sub-board or the second sub-board is connected from the bottom Power supply and control signals; the first radio frequency processing module and the second radio frequency processing module introduce and output radio frequency signals vertically; both the first radio frequency processing module and the second radio frequency processing module contain polarization switching chips. In the present invention, the radio frequency processing link and the low frequency processing circuit are arranged in partitions of the upper and lower cavities, so as to realize full utilization of the thickness space, improve the module integration degree, and have dual-frequency operation and polarization switching capabilities.

Description

technical field [0001] The invention relates to the technical field of active phased array antennas, in particular to a dual-frequency dual-polarization TR module. Background technique [0002] Active phased array antenna front-end technology is gradually developing towards dual-frequency compounding and high integration with the improvement of phased array antenna system performance, the development of high-frequency materials and processes, and the advancement of micro-assembly technology. At present, the structure of active phased array antenna mainly includes brick integration and tile integration. The tile active phased array antenna is mostly used in single-frequency single-channel or single-frequency The array antenna can be designed with multi-frequency and multi-channel according to the needs, but the integration level is low, and the volume will be doubled. [0003] CN210297691U discloses a phased array multi-band TR module, which independently encapsulates the TR...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/401H05K7/02H05K7/20
CPCH04B1/401H05K7/02H05K7/20336
Inventor 伍海林丁卓富吴凤鼎赵伟王小伟张磊
Owner 成都雷电微力科技股份有限公司
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