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Polyimide film and preparation method thereof

A polyimide film and a polymerization reaction technology, applied in the field of polyimide film and its preparation, can solve the problems of poor stability, increased cost, uneven mixing and the like

Active Publication Date: 2021-08-06
上海炫柔电子材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some disadvantages in the above two methods, such as a long development cycle for new monomers; adding additives will lead to uneven mixing and poor stability; and the most important problem is that it will increase costs

Method used

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  • Polyimide film and preparation method thereof
  • Polyimide film and preparation method thereof

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preparation example Construction

[0022] The invention provides a kind of preparation method of polyimide film, comprises the following steps:

[0023] (1) mixing 4,4'-diaminodiphenyl ether, an organic solvent and pyromellitic anhydride to perform a first polymerization reaction to obtain a first precursor solution;

[0024] (2) mixing the first precursor solution obtained in the step (1) with p-phenylenediamine, an organic solvent and pyromellitic anhydride, and performing a second polymerization reaction to obtain a second precursor solution;

[0025] (3) First coating the second precursor solution obtained in the step (2) on the substrate, and then performing imidization treatment to obtain a polyimide film.

[0026] The present invention mixes 4,4'-diaminodiphenyl ether, an organic solvent and pyromellitic anhydride to perform a first polymerization reaction to obtain a first precursor solution. In the invention, 4,4'-diaminodiphenyl ether (ODA), an organic solvent and pyromellitic anhydride (PMDA) are fi...

Embodiment 1

[0053] Step 1: Add ODA (12.0g, 0.06mol) into a 500mL reactor, add DMAc (186.1g), turn on mechanical stirring and control the temperature at 35°C to dissolve ODA; after ODA is completely dissolved, control the temperature of the solution to drop to 25°C, add PMDA (12.64g, 0.058mol), under the protection of nitrogen, carry out the first polymerization reaction 0.5h, obtain the first precursor solution;

[0054] Step 2: Dissolve PDA (15.12g, 0.14mol) in DMAc (186.1g), then add to the first precursor solution and mix, add PMDA (28.78g, 0.132mol) after mixing completely, react for 0.5h, and then Add PMDA (1.31g, 0.006mol) to react for 0.5h, add PMDA (0.872g, 0.004mol) again to react for 0.5h, and the time of the second polymerization reaction is 1.5h in total to obtain the second precursor solution;

[0055] Step 3: Use an automatic coating machine to coat the second precursor solution on the glass plate with a wet film thickness of 150 μm, put it on a constant temperature heating ...

Embodiment 2

[0057] Step 1: Add ODA (16.0g, 0.08mol) into a 500mL reactor, add DMAc (201.9g), turn on mechanical stirring and control the temperature at 35°C to dissolve ODA; after ODA is completely dissolved, control the temperature of the solution to drop to 25°C, add PMDA (17.0g, 0.078mol), carry out the first polymerization reaction 0.5h under nitrogen protection, obtain the first precursor solution;

[0058] Step 2: Dissolve PDA (12.96g, 0.12mol) in DMAc (201.9g), then add to the first precursor solution and mix, add PMDA (28.78g, 0.132mol) after mixing completely, react for 0.5h, and then Add PMDA (1.31g, 0.006mol) to react for 0.5h, add PMDA (0.872g, 0.004mol) again to react for 0.5h, and the time of the second polymerization reaction is 1.5h in total to obtain the second precursor solution;

[0059] Step 3: Use an automatic coating machine to coat the second precursor solution on the glass plate with a wet film thickness of 150 μm, put it on a constant temperature heating table at ...

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Abstract

The invention provides a polyimide film and a preparation method thereof, and belongs to the technical field of films. The invention provides a polyimide film preparation method, which comprises: mixing 4, 4 '-diaminodiphenyl ether, an organic solvent and pyromellitic dianhydride, and carrying out a first polymerization reaction to obtain a first precursor solution; mixing the first precursor solution with p-phenylenediamine, an organic solvent and pyromellitic dianhydride, and carrying out a second polymerization reaction to obtain a second precursor solution; and coating a substrate with the second precursor solution, and then carrying out imidization treatment to obtain the polyimide film. Experimental results show that the thermal expansion coefficient and the mechanical property of the polyimide film prepared by the preparation method provided by the invention are superior to those in the prior art.

Description

technical field [0001] The invention belongs to the technical field of thin films, and in particular relates to a polyimide thin film and a preparation method thereof. Background technique [0002] Polyimide is a high molecular polymer containing imide groups. Because of its excellent mechanical properties, heat resistance, insulation, light weight, and flexibility, it is widely used in the fields of microelectronics and aerospace. In the flexible display industry, the temperature of the flexible substrate even exceeds 300°C during processing. Therefore, polyimide is required to have a low coefficient of thermal expansion (CTE). [0003] At present, there are two main ways to improve the CTE of polyimide. One is the monomer structure. When synthesizing the polyimide precursor solution polyamic acid, the polyimide monomer containing rigid structure can be used to make the polymerization It is easier to crystallize the compound, increase the interaction force of the internal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10
CPCC08J5/18C08G73/1071C08G73/1007C08G73/1042C08J2379/08
Inventor 李喜峰张涵陈龙龙张建华
Owner 上海炫柔电子材料有限公司
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