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PCB negative film production process

A production process and PCB board technology, applied in the field of PCB negative film production process, can solve the problems of high recycling and processing costs, reduced production capacity of PCB negative films, waste of resources, etc., and achieve lower tin use and recycling costs, reasonable production capacity matching, and negative film production. The effect of productivity improvement

Inactive Publication Date: 2021-07-30
江门市奔力达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a PCB negative film production process, which has the ability to improve the production capacity of negative films; increase the proportion of negative film production from 10% to 40%, more reasonable production capacity matching, maximize production capacity and tin use and recycling processing costs 30% reduction, the advantages of energy saving and waste reduction, solve the problem of reduced production capacity of PCB negative film, high cost of tin use and recycling, and waste of resources

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] After fixing the PCB board, use a punching machine to drill holes; sinking copper: deposit a thin layer of chemical copper on the drilled non-conductive PCB board by chemical method; DVCP thickening: DVCP uses current Deposit metal or alloy on the surface of the workpiece to form a uniform, dense, and well-bonded metal layer; plug hole: use the PCB as a VIA hole for conduction, and print ink or resin into the hole by machine printing; grinding plate: Polish the rough surface of the PCB board smoothly; dry film: use the photosensitive phase-dissolving function of the dry film to polymerize the required circuit pattern by light, leaving the required circuit pattern, and remove the excess copper by electroplating and etching, leaving Copper surface and wiring are required; acid etching (etching → film removal): immerse the PCB in an acid etching solvent for cleaning to remove the oxide film at the hollowed out part; remove the unprotected non-conductor part of the printed c...

Embodiment 2

[0041] In embodiment one, add following operation:

[0042] In step 2, a layer of 0.3um-0.5um copper is deposited on the hole wall by using the principle of chemical reaction, so that the originally insulated hole wall has conductivity, which facilitates the smooth progress of subsequent panel plating and pattern plating.

[0043] After fixing the PCB board, use a punching machine to drill holes; sinking copper: deposit a thin layer of chemical copper on the drilled non-conductive PCB board by chemical method; DVCP thickening: DVCP uses current Deposit metal or alloy on the surface of the workpiece to form a uniform, dense, and well-bonded metal layer; plug hole: use the PCB as a VIA hole for conduction, and print ink or resin into the hole by machine printing; grinding plate: Polish the rough surface of the PCB board smoothly; dry film: use the photosensitive phase-dissolving function of the dry film to polymerize the required circuit pattern by light, leaving the required ci...

Embodiment 3

[0045] In embodiment two, add following operation:

[0046] In step 3, DVCP thickening is to plate the thickness of the copper plating layer to the required thickness range of 20-25um.

[0047]After fixing the PCB board, use a punching machine to drill holes; sinking copper: deposit a thin layer of chemical copper on the drilled non-conductive PCB board by chemical method; DVCP thickening: DVCP uses current Deposit metal or alloy on the surface of the workpiece to form a uniform, dense, and well-bonded metal layer; plug hole: use the PCB as a VIA hole for conduction, and print ink or resin into the hole by machine printing; grinding plate: Polish the rough surface of the PCB board smoothly; dry film: use the photosensitive phase-dissolving function of the dry film to polymerize the required circuit pattern by light, leaving the required circuit pattern, and remove the excess copper by electroplating and etching, leaving Copper surface and wiring are required; acid etching (et...

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Abstract

The invention discloses a PCB negative film production process. The production process comprises the following steps of: fixing a PCB and then drilling the PCB by using a punching machine; carrying out electroless copper plating: depositing a layer of thin chemical copper on the drilled non-conductive PCB by using a chemical method; conducting DVCP thickening, specifically, depositing metal or alloy on the surface of a workpiece through DVCP by means of current to form a uniform and compact metal layer with good binding force; plugging a hole: plugging printing ink or resin into a VIA hole used for conduction of the PCB through machine printing; polishing the board: polishing the rough surface of the PCB to be smooth; and drying the film; The invention aims to provide a PCB negative film production process which can improve the negative film production capacity. The production ratio of the negative film is increased from 10% to 40%, the productivity matching is more reasonable, the productivity is maximized, the tin use and recovery treatment cost is reduced by 30%, the energy is saved, the waste is reduced, and the problems that the production productivity of the PCB negative film is reduced, the tin use and recovery treatment cost is higher, and resources are wasted are solved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a production process of a PCB negative film. Background technique [0002] PCB, the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Since it is made by electronic printing, it is Called "printing". [0003] Circuit Board At present, with the development of the electronics industry, PCB boards, as important electronic components, have been widely used. Negative film board is an important means of PCB board manufacturing. In the production process of PCB, there are positive film and negative film processes in the process of electroplating graphics. Expenses, production costs and subsequent disposal costs are very high, and it is easy to cause secondary pollution. The negative film process can solve...

Claims

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Application Information

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IPC IPC(8): H05K3/02H05K3/06H05K3/42H05K3/00
CPCH05K3/022H05K3/064H05K3/42H05K3/0094H05K2203/0548
Inventor 万德武谢宇光张勇
Owner 江门市奔力达电路有限公司
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