Manufacturing method of electromagnetic shielding material, electromagnetic shielding material and electronic product

A technology of electromagnetic shielding materials and manufacturing methods, which is applied in the fields of magnetic field/electric field shielding, metal material coating technology, electrical components, etc., and can solve the problems of affecting the performance of electromagnetic shielding films, reducing the thickness of electromagnetic shielding materials, and increasing the complexity of electromagnetic shielding films and other issues, to achieve the effect of improving the use effect and flexibility of use, reducing material costs, and overcoming poor plating

Pending Publication Date: 2021-07-30
深圳市乐工新技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the real problem is that if the thickness of the polymer film is further reduced, it is more difficult to achieve the plating of the metal layer.
In order to reduce the thickness of the polymer film, an adhesive layer is first coated on the surface of the thin polymer film, and then the metal layer is deposited. However, the structure of the electromagnetic shielding film obtained by this method increases in complexity, and the electromagnetic shielding The overall thickness of the material is limited, and because the glue is easy to age, it is easy to cause delamination after long-term use, which will affect the performance of the electromagnetic shielding film

Method used

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  • Manufacturing method of electromagnetic shielding material, electromagnetic shielding material and electronic product
  • Manufacturing method of electromagnetic shielding material, electromagnetic shielding material and electronic product
  • Manufacturing method of electromagnetic shielding material, electromagnetic shielding material and electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A polymer film layer is provided, the thickness of the polymer film layer is 1.5 microns, and the material is polyethylene terephthalate.

[0044] The polymer film layer is baked at a temperature of 45 degrees centigrade for 24 hours.

[0045] Corona treatment is performed on one surface of the baked polymer film layer, and the corona treatment time is 1 second. The surface had a dyne value of 50 after corona treatment.

[0046] A layer of metal shielding layer is sputtered on the roughened surface of the polymer film layer, using copper as the target material, and continuous winding coating is adopted. The coating process conditions are: vacuum degree 0.2Pa, continuous winding plating speed 15m / min, the coating current is 1A, and the coating voltage is 700V. The resulting metal shielding layer had a thickness of 3000 nm.

[0047] The metal shield is subjected to anti-oxidation treatment with a peroxygen protectant.

Embodiment 2

[0049] A polymer film layer is provided, the thickness of the polymer film layer is 4 microns, and the material is polycarbonate.

[0050] The polymer film layer is baked at a temperature of 80 degrees centigrade for 1 hour.

[0051] Corona treatment is performed on one surface of the baked polymer film layer, and the corona treatment time is 10 seconds. The surface had a dyne value of 56 after corona treatment.

[0052] The first layer of metal shielding layer is sputtered on the roughened surface of the polymer film layer, using zinc as the target material, and continuous winding coating is adopted. The coating process conditions are: vacuum degree 0.02Pa, continuous winding coating speed is 30m / min, the coating current is 30A, and the coating voltage is 680V. The obtained first metal shielding layer had a thickness of 1000 nanometers.

[0053] The second metal shielding layer is sputtered on the surface of the first metal shielding layer, with copper as the target mater...

Embodiment 3

[0055] A polymer film layer is provided, the thickness of the polymer film layer is 2 microns, and the material is polypropylene.

[0056] The two surfaces of the polymer film layer were subjected to corona treatment, and the corona treatment time was 5 seconds respectively. The dyne values ​​of the two surfaces after corona treatment were 40 respectively.

[0057] A layer of metal shielding layer is respectively sputtered on the two surfaces of the roughened polymer film layer, with titanium as the target material, and continuous winding coating is adopted. The coating process conditions are: vacuum degree 0.2Pa, continuous winding coating speed It is 295m / min, the coating current is 1A, and the coating voltage is 700V. The thickness of each metal shielding layer obtained is 3000 nanometers; or the thickness of one metal shielding layer is 1500 nanometers, and the thickness of the other metal shielding layer is 3000 nanometers.

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Abstract

The invention discloses a manufacturing method of an electromagnetic shielding material, the electromagnetic shielding material manufactured by the manufacturing method and an electronic product applying the electromagnetic shielding material. The manufacturing method of the electromagnetic shielding material comprises the following steps that a polymer film layer is provided, and the thickness of the polymer film layer is larger than or equal to 1.5 microns and smaller than or equal to 6 microns; at least one surface of a polymer film is subjected to roughening treatment, so that the dyne value of the at least one surface is larger than or equal to 44 and smaller than or equal to 70; and at least one metal shielding layer is deposited on the roughened surfaces. According to the manufacturing method of the electromagnetic shielding material, the thickness of the polymer film layer can be reduced by 75% to the maximum extent, the flexibility of the electromagnetic shielding material is better, the using effect is better, and the product cost is lower.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to a manufacturing method of an electromagnetic shielding material, an electromagnetic shielding material prepared by the method, and an electronic product using the electromagnetic shielding material. Background technique [0002] The signal of the communication cable will encounter the interference of high-voltage electromagnetic field, low-voltage electromagnetic field, or high-frequency electric wave during the transmission process. The longer the cable length, the greater the interference and the more loss. To solve this problem, it is necessary to coat the communication cable with electromagnetic shielding material, such as electromagnetic shielding film, to resist electromagnetic interference. [0003] In the existing electromagnetic shielding film structure, a metal layer is usually plated on a polymer film by physical vapor deposition, such as by vacuum pl...

Claims

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Application Information

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IPC IPC(8): C23C14/02C23C14/20C23C14/34H05K9/00H01B11/06
CPCC23C14/022C23C14/205C23C14/34H05K9/0084H05K9/0098H01B11/06
Inventor 夏祥国李林军任诗举
Owner 深圳市乐工新技术有限公司
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