Heating body, preparation method thereof, heating assembly and aerosol generating device

Abstract

The invention relates to a heating element and a preparation method thereof, the heating element is formed by stacking a plurality of conductive layers and a plurality of insulating layers at intervals and integrally sintering, and the conductive layer is arranged on the outermost layer. The heating body provided by the embodiment of the invention is formed by compounding the plurality of conductive layers and the plurality of insulating layers, so that the heating temperature of the heating body is ensured to be uniformly distributed during heating, and the heating body has the characteristics of quick temperature rise, high heat efficiency, high heat conductivity and the like; the bending strength, fracture toughness and other properties of the whole heating body can be adjusted by adjusting the thickness of the ceramic insulating layer during preparation according to actual conditions, so that the heating body is not easy to break in actual application, and the service life is ensured; due to the fact that the conducting layers and the insulating layers are stacked at intervals and form a whole after high-temperature co-firing, the problem that the conducting tracks fall off in the using process does not exist, and the problem that the conducting tracks printed on an existing base body fall off after being used for a long time is solved.

Description

technical field [0001] The invention belongs to the technical field of aerosol devices, and in particular relates to a heating element and a preparation method thereof, a heating component and an aerosol generating device. Background technique [0002] As a new type of releasable aerosol product, the heat-not-burn device reduces the temperature of the aerosol from 800°C to about 400°C, and at the same time, the harmful substances such as tar and carbon monoxide in the aerosol are significantly reduced, which is in line with people's pursuit of a healthy life concept. [0003] At present, the heat source of the mainstream heat-not-burn equipment in the market is to print gold, silver, platinum, nickel and other metal pastes on the sheet-type, pin-type and cylindrical ceramic substrates, and form a metal conductive track with a certain resistance after sintering. The heat generated by the conductive track is transferred to the entire substrate, thereby realizing the heating o...

AI Technical Summary

Problems solved by technology

[0004] 1. In order to improve the heat transfer efficiency, the chip type and pin type used are thin-walled, low in strength, and easy to break during use, resulting in product failure;

[0005] 2. When the cylindrical structure is adopted, by printing conductive paste on the surface of the cylindrical ceramic substrate, the heat transfer process loses a lot and the thermal efficiency is low;

[0006] 3. Conductive traces are printed on the surface of the ceramic substrate, the production process is strict, the cost is high, and the yield rate is low. During dry firing, it is easy to burn out at the line defect and fail;

[0007] 4. As the use time prolongs, the conductive track on the surface of the substrate is easy to oxidize, resulting in an increase in the resistance of the conductive track, resulting in a decrease in the heating effect, and the conductive track is easily separated from the substrate

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