Linear magnetic circuit device and electromagnetic induction heater
A magnetic circuit, linear technology, applied in the direction of electric/magnetic/electromagnetic heating, induction heating, coil device, etc., can solve the problem of uneven heating temperature distribution, and achieve good heating effect, uniform heating temperature distribution, and uniform magnetic field distribution. Effect
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Embodiment 1
[0046] This embodiment provides a linear magnetic circuit device to solve the technical problem of uneven heating temperature distribution of the electromagnetic induction heater in the prior art. Specifically, the magnetic circuit in the prior art is broken by a non-magnetic support plate, resulting in the magnetic field being divided into multiple sections, and the discontinuous magnetic field causes uneven heating temperature distribution.
[0047]The linear magnetic circuit device includes a magnetizer 1, a heat dissipation sheet 2, a coil 3 and a supporting assembly. As a best implementation mode of this embodiment, the magnetizer 1 in this embodiment is a silicon steel sheet or a magnetically conductive Sheet structure, the heat dissipation sheet 2 is an aluminum sheet or copper sheet with good thermal conductivity and insulation sheet structure, and the thickness of the heat dissipation sheet 2 is 0.3mm to 0.5mm, such as 0.3mm, 0.5mm, etc. A plurality of magnetic conduc...
Embodiment 2
[0051] This embodiment serves as an implementation of Embodiment 1, specifically, this embodiment provides a middle support structure 5 .
[0052] The heat dissipation sheet 2 in this embodiment includes several middle sheets located in the middle of the magnetic circuit. The middle support structure 5 in this embodiment includes a first block 501, and one end of the first block 501 is insulated and connected to at least two middle sheets. Specifically, one end of the first block 501 is insulated and connected to two adjacent middle sheets, and the other end of the first block 501 is insulated and connected to the frame 6 . In this structure, the first block 501 is used to pull and hook the heat dissipation sheet 2 in the magnetic circuit, so as to support the middle of the magnetic circuit, and the first block 501 does not block the magnetic circuit.
[0053] As a specific implementation of this embodiment, the central support structure 5 in this embodiment also includes a fi...
Embodiment 3
[0058] This embodiment serves as another implementation manner of Embodiment 1, specifically, this embodiment provides a middle support structure 5 .
[0059] The heat dissipation sheet 2 in this embodiment includes several middle sheets located in the middle of the magnetic circuit, and the middle sheet is divided into a first sheet and a second sheet. The middle support structure 5 in this embodiment includes a first plate 511, At least two first sheets are integrally formed or welded with a first plate body 511, and the free ends of the first plate body 511 are integrally formed or welded with a first connecting plate 513, and the first connecting plate 513 is opposite to the first plate body 511 is vertical, and the first connecting plate 513 is insulated and connected to the frame 6 . The first sheet in this embodiment is a structural member with a shape different from that of conventional heat sinks, which not only serves to dissipate heat, but also serves as a support f...
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