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Magnetron assembly and magnetron sputtering equipment

A magnetron and component technology, which is applied in sputtering plating, ion implantation plating, metal material coating process, etc., can solve the problems of limited improvement and inability to find the size of the magnetron, and achieves convenient and shortened installation. time, the effect of improving the uniformity of distribution

Active Publication Date: 2016-07-20
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

Compared with the two, the size of the magnetron is reduced, but the magnetic field strength of the outer ring is also reduced due to the reduction of one magnet, and the power density is slightly improved, but the improvement is limited
There is a corresponding relationship between the magnetic field strength of the outer ring magnet and the number of magnets. Reducing the number of magnets will cause a jump in the magnetic field strength of the outer ring, so that this technology cannot find a better magnetron size

Method used

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  • Magnetron assembly and magnetron sputtering equipment
  • Magnetron assembly and magnetron sputtering equipment
  • Magnetron assembly and magnetron sputtering equipment

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Embodiment Construction

[0032] In order for those skilled in the art to better understand the technical solution of the present invention, the magnetron assembly and the magnetron sputtering equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0033] The magnetron assembly provided by the present invention includes a central permanent magnet and an annular permanent magnet surrounding the central permanent magnet. The central permanent magnet and the annular permanent magnet have opposite polarities; wherein the annular permanent magnet adopts an integrated structure. By adopting the ring-shaped permanent magnet of the above-mentioned one-piece structure as the outer ring magnet surrounding the central permanent magnet, the following advantages can be obtained:

[0034] First, the magnetron assembly provided by the present invention replaces a plurality of small magnets in the prior art by using an annular permanent magnet with an...

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Abstract

The invention provides a magnetron assembly and magnetron sputtering equipment. The magnetron assembly comprises a center permanent magnet and annular permanent magnets surrounding the center permanent magnet. The polarity of the center permanent magnet is opposite to that of the annular permanent magnets. The annular permanent magnets are of an integrated structure. According to the magnetron assembly provided by the invention, installing is convenient and safe, the distribution uniformity of outer ring magnetic fields can further be improved, the higher magnetic field intensity is achieved under the condition of the same-size outer ring magnets, and thus the higher power density can be obtained under the condition that the effect that the magnetic field intensity is not decreased is ensured.

Description

technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a magnetron assembly and a magnetron sputtering device. Background technique [0002] Magnetron sputtering equipment is a device that deposits the material sputtered from the target material on the workpiece to be processed to form a thin film by colliding particles in the plasma with the target material. In practical applications, in order to improve the efficiency of sputtering and the utilization of the target, a magnetron is installed on the back of the target, and the magnetic field generated by the magnetron is used to extend the trajectory of electrons to increase the electron and process gas ( Such as the probability of argon) collision, thereby increasing the density of the plasma, thereby improving the efficiency of sputtering and the utilization of the target. [0003] figure 1 It is a three-dimensional view of an existing magnetron. figure 2 for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 李冰边国栋宿晓敖
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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