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Wafer cleaning method

A wafer, spray cleaning technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of higher efficiency than manual, leaving traces, drug printing defects, etc., to increase the variety of wafers and ensure stability performance, and the effect of improving the pass rate

Active Publication Date: 2021-07-16
广东先导微电子科技有限公司
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Problems solved by technology

The advantages of the existing automated cleaning are that the chemical solution can be continuously updated, there is no flushing interval, the automation program is high, the cleaning effect is stable, and the efficiency is higher than that of manual cleaning; When there are more obvious planar bumps (such as the pillars that limit and drive the wafer, etc.), there will be traces of drug printing defects
At the same time, the overall surface of the wafer is usually smooth after surface polishing, but some require laser typing on the main surface of the wafer for certain needs. When performing conventional single-chip cleaning, the corrosive liquid flows Marks will be left after laser typing

Method used

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  • Wafer cleaning method

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Embodiment Construction

[0024] The present invention will be described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention. In addition, those skilled in the art can make corresponding combinations of features in the embodiments in this document and in different embodiments according to the descriptions in this document.

[0025] The existing wafer cleaning method is usually to spray the cleaning solution on the wafer surface at the center of the wafer, and use the centrifugal force generated by the rotation of the wafer to throw the cleaning solution to the edge to clean the surface evenly. However, when there is unevenness on the wafer surface, or laser marking is required on the main surface of the wafer for some purposes, when performing conventional single-wafer cleaning, the corrosive liquid will leave traces after flowing through the...

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Abstract

The invention discloses a wafer cleaning method, which comprises the following steps of: providing a wafer with a surface obstacle on the edge, rotating the wafer along the axis, and forming a main spraying opening above the wafer to spray cleaning liquid medicine to the middle region of the wafer for cleaning; forming an auxiliary spraying opening above the wafer to spray cleaning liquid medicine to the surface of the wafer for cleaning, wherein the distance between the auxiliary spraying opening and the axis of the wafer is not smaller than the distance between the surface obstacle and the axis of the wafer, and the spraying region of the auxiliary spraying opening at least covers the annular region formed by rotation of the surface obstacle. According to the wafer cleaning method, the problems of medicine mark defects and the like caused by obstacles such as laser printing can be effectively eliminated, the cleaning efficiency is high, and the cleaning effect is good and stable.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a wafer cleaning method, in particular to a cleaning method capable of removing drug marks on the wafer surface due to laser typing. Background technique [0002] Modern technology has very high requirements on the cleanliness, flatness and curvature of the wafer surface used for epitaxy. Therefore, it is usually necessary to clean the wafer to remove the particle impurities attached to the wafer surface and the metal ions on the surface. Wafer cleaning is divided into manual cleaning and automatic cleaning. Since automatic cleaning has the advantages of high cleaning efficiency, stable pass rate, and much lower error rate than manual cleaning, the cleaning method of wafers has gradually changed from manual cleaning to automatic cleaning. [0003] In terms of automatic cleaning, there are mainly tank cleaning and single chip cleaning. Tank cleaning is to pl...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/67051H01L21/02057Y02P70/50
Inventor 郭炳熙米艳娇周铁军
Owner 广东先导微电子科技有限公司
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