Processing method of piezoelectric composite material

Abstract

The invention discloses a processing method of a piezoelectric composite material. The processing method comprises the following steps: 1) attaching a second surface of the piezoelectric material to a plane; 2) cutting the first surface of the piezoelectric material and forming a first cutting groove on the first surface; (3) filling the first cutting groove with a polymer, and curing the polymer; (4) taking down the piezoelectric material from the plane; (5) attaching the first face of the piezoelectric material to the plane; (6) cutting the second face of the piezoelectric material along the first cutting groove, a second cutting groove is formed in the second face, so that the first cutting groove and the second cutting groove are communicated; (7) filling the second cutting groove with a polymer, and curing the polymer; and 8) taking down the piezoelectric material from the plane to obtain the piezoelectric composite material. The processing method of the piezoelectric composite material can meet the processing requirements of array piezoelectric materials and the requirements of improving the yield and consistency, and has the advantages of being simple and low in cost.

Description

technical field [0001] The invention belongs to the technical field of general piezoelectric devices, in particular to a processing method of piezoelectric composite materials. Background technique [0002] Piezoelectric ultrasonic transducer is the core component of ultrasonic nondestructive testing, which realizes the conversion between electrical energy and acoustic energy through the piezoelectric effect of piezoelectric elements. Piezoelectric elements are generally divided into piezoelectric ceramics, piezoelectric crystals, piezoelectric polymers, and piezoelectric composites. Piezoelectric composite materials refer to functional materials composed of piezoelectric ceramics and polymers combined in a certain way. Since piezoelectric composite materials have the advantages of both piezoelectric phase and polymer phase, they are widely used in industrial non-destructive testing, medical Ultrasonic imaging and other fields have important applications, among which 1-3 pi...

AI Technical Summary

Problems solved by technology

[0004] The cutting-filling method is mainly used to prepare piezoelectric composite materials with a frequency of 0.5-10MHz. For the processing of piezoelectric composite materials above 15MHz, due to the thin blade of the cutting knife, affected by the processing distance, processing depth and processing method, it is easy to cause Defects such as piezoelectric phase collapse, fracture, and irregular grooving lead to a high scrap rate. Even if the above defects do not occur, the material properties may fail to meet expectations due to mechanical stress damage and other reasons

Therefore, the existing cut-fill method cannot meet the performance and consistency processing requirements of high-frequency array transducers, which seriously restricts the production of high-frequency array transducers

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