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Substrate heating unit, substrate processing apparatus, and substrate processing method

A technology for heating units and substrates, applied in cleaning methods and appliances, chemical instruments and methods, cleaning methods using liquids, etc., can solve problems such as poor craftsmanship, and achieve the effect of minimizing temperature deviation

Pending Publication Date: 2021-06-29
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In this way, if the temperature of the substrate is not uniform as a whole, the etching rate for the substrate may vary according to the temperature range, which may lead to poor process

Method used

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  • Substrate heating unit, substrate processing apparatus, and substrate processing method
  • Substrate heating unit, substrate processing apparatus, and substrate processing method
  • Substrate heating unit, substrate processing apparatus, and substrate processing method

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Embodiment Construction

[0090] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement. However, the present invention can be realized in various forms and is not limited to the embodiments described here.

[0091] In the description of the embodiments of the present invention, when it is judged that specific descriptions for related known functions or structures may unnecessarily confuse the gist of the present invention, the detailed descriptions will be omitted, and the parts with similar functions and effects are used throughout all appended Figures use the same reference numbers.

[0092] At least some of the terms used in the specification are defined in consideration of functions in the present invention, and thus may differ according to users, operators' intentions, practices, and the like. Therefore, its...

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Abstract

The invention relates to a substrate heating unit, a substrate processing apparatus, and a substrate processing method. When a substrate is processed, one of a first light beam (a flat-topped laser beam in an overall uniform form) having a homogenized energy distribution and a second light beam (a flat-topped laser beam in an edge-strengthened form) having an energy distribution in which an edge region is strengthened is selectively supplied to the substrate, therefore, the substrate can be heated to an overall uniform temperature, and the temperature deviation of the substrate can be minimized under the condition that the temperature of the edge region of the substrate is relatively low.

Description

technical field [0001] Embodiments of the invention relate to a unit for heating a substrate while processing the substrate. Additionally, embodiments of the invention relate to apparatus and methods for processing substrates using such units. Background technique [0002] To manufacture semiconductors, flat panel displays (FPDs), and the like, various processes need to be performed. For example, in order to process a substrate such as a wafer, a photoresist coating process, a developing process, an etching process, an ashing process, etc. may be performed. In addition, in order to remove contaminants attached to the substrate in these processes, a wet cleaning process of cleaning the substrate with a treatment liquid, a drying process of removing the treatment liquid remaining on the substrate, and the like may be performed. [0003] Recently, an etching process for selectively removing a silicon nitride film, a silicon oxide film, or the like is performed using a treatme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/311
CPCH01L21/6708H01L21/67115H01L21/31111B23K2101/40B23K2103/56B23K26/0006B23K26/352B23K26/034B23K26/073B23K26/0732B23K26/0608B23K26/067B23K26/0648B23K26/0652H01L21/67051H01L21/67248G02B27/0955G02B27/0916H01S3/13H01S3/005G02B7/028H01L21/68764H01L21/02057H01L21/268H01L22/20B08B3/10B23K26/0604B23K26/0626B23K26/064
Inventor 金泰信郑暎大郑智训李智暎金源根
Owner SEMES CO LTD
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