Photosensitive resin composition for photocuring 3D printing high-toughness product and preparation method of photosensitive resin composition

Abstract

The invention discloses a photosensitive resin composition for a photocuring 3D printing high-toughness product and a preparation method of the photosensitive resin composition. The preparation method comprises the following steps: dissolving 5-30% of MBS resin in ethyl acetate / vinyl acetate to prepare an MBS solution, then mixing and adding 20-60% of an acrylic-terminated flexible polyurethane prepolymer, 20-60% of acrylate resin, 5-30% of polyethylene glycol dimethacrylate resin and 20-50% of a reactive diluent, conducting mixing and heating to 30-110 DEG C, conducting stirring and mixing for 0.5-12 hours, removing a solvent in vacuum, and finally, adding 0.1-1.0% of a defoaming agent, 0.1-1.0% of a flatting agent, 0.1-1.0% of an antioxidant and 0.1-5.0% of a photoinitiator, and uniformly conducting stirring and mixing to obtain the photosensitive resin composition for the photocuring 3D printing high-toughness product. The high-toughness photosensitive resin composition for photocuring 3D printing prepared by the invention has the characteristic of high toughness, and also has the characteristics of low viscosity, low shrinkage, high curing speed and the like which accord with a photocuring 3D printing forming process.

Description

technical field [0001] The invention relates to a photosensitive resin composition for photocuring 3D printing high-toughness products and a preparation method thereof, belonging to the technical field of chemical industry. Background technique [0002] The essence of light-curing 3D printing technology is an additive advanced manufacturing technology. The main principle is to discretize the required molding objects through digital models, and then make the required moldings through the orderly accumulation of materials. It has the advantages of fast forming speed, high printing precision and good surface quality. At present, stereolithography 3D printing mainly includes laser stereolithography (Stereolithography Appearance, abbreviated as SLA) 3D printing and digital light projection (Digital LightProcession, abbreviated as DLP) 3D printing. And its supporting photosensitive resin is the core technology to realize light curing 3D printing. [0003] There are many kinds of...

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Problems solved by technology

[0003] There are many kinds of materials for 3D printing. For example, acrylate and epoxy photosensitive resins are currently commonly used 3D printing photocuring materials. However, there are some shortcomings in the application: the curing process of acrylate photosensitive resins is a free radical chain polymerization mechanism. , and finally form a dense and uneven network, resulting in brittle and hard products with obvious shrinkage and large residual stress, which not only affects the 3D printing accuracy but also affects the applicability of the product. In addition, acrylic resin also has the problem of oxygen inhibition; Although oxygen-based photosensitive resins do not have the problem of oxygen inhibition, their curing speed is slow, which affects the efficiency of 3D printing, and requires more expensive cationic catalysts, which are costly

The above two types of materials are mainly used for 3D printing of thermosetting resin materials, which have high hardness, but these resins have defects of insufficient toughness, poor impact resistance, and poor elasticity.

For example, the Chinese patent document CN104765251A discloses a photosensitive resin for high toughness 3D printing and its preparation method. The method uses tough photosensitive resin and rigid photosensitive resin as raw materials, and is used in 3D printing of SLA or DLP to obtain a hard thermosetting material. , which improves the toughness of the material, but there is still the problem of oxygen inhibition

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