Blind-hole type multi-layer mixed-pressed aluminum substrate preparation process and multi-layer mixed-pressed aluminum substrate

Abstract

The invention discloses a blind-hole type multi-layer mixed-pressed aluminum substrate preparation process, which includes making a base layer, a medium layer and a core layer, and performing milling treatment on the slotting areas of the base layer, medium layer and core layer respectively, wherein the grooves of the base layer The size of the groove is smaller than the size of the core layer, and the size of the groove of the core layer is smaller than the size of the groove of the medium layer; the base layer, the medium layer and the core layer after the milling groove treatment are stacked in sequence and pressed to obtain the aluminum substrate; according to the aluminum Dimensions of the grooves of the core layer on the substrate The excess part of the grooves of the base layer is milled away so that the dimensions of the grooves of the base layer are the same as the dimensions of the grooves of the core layer. After the lamination of the present invention, it is only necessary to mill off the redundant part of the groove of the base layer relative to the groove of the core layer, so that the size of the groove of the base layer is the same as that of the core layer, so that the alignment accuracy between layers can be ensured, and the gap between layers can be significantly improved. The problem of offset, and because the area that needs to be milled off the base layer after lamination is small, the contact surface between the milling cutter and the base layer is small, which can significantly improve the problem of milling surface burrs.

Description

technical field [0001] The invention relates to the technical field of metal-based printed circuit boards, in particular to a preparation process of a blind-hole type multi-layer mixed-pressed aluminum substrate and a multi-layer mixed-pressed aluminum substrate. Background technique [0002] With the continuous upgrading of electronic products, high-power electronic products are emerging to meet the higher performance requirements of electronic products, and high-power electronic products have higher and higher requirements for heat dissipation of components. If the heat dissipation of the substrate is not good Well, it will cause the components to overheat, which will reduce the reliability of the whole machine and shorten the service life. In this context, high heat dissipation metal-based printed circuit boards were born. Metal-based printed circuit boards are a special type of printed circuit boards, mainly including copper substrates, aluminum substrates, stainless ste...

AI Technical Summary

Problems solved by technology

[0003] There are mainly two traditional multi-layer mixed-pressed aluminum substrate preparation processes. One is to laminate the FR4 core board milled with cooling grooves and the entire aluminum substrate, and then mill out the window area of ​​the aluminum substrate. During groove operation, due to the large contact area between the milling cutter and the aluminum substrate, the surface of the milled groove has burrs, and the reject rate is high; Lamination, but in the actual lamination, the slots of the FR4 core board and the slots of the aluminum substrate are easy to shift, which directly affects the product quality

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