Iterative solution method and device for interlayer coupling of multilayer VLSI

Abstract

The present invention provides an iterative solution method and device for the interlayer coupling of a multi-layer VLSI, wherein the iterative solution method includes the following steps: first, set the first m The initial active layer of the source layer is all layers of the integrated circuit; secondly, for the first m The source layer is iterated, and the dyadic Green's function is used to calculate the first m layer distribution of current on the l layers of influence G ml , and update the l The source item of the layer, for the first l The layer applies two-dimensional finite element to calculate its field distribution to update the field and current distribution of the layer, and obtain the change of the layer field compared with the previous iteration result E ml ,Compare G ml The effective influence value of the dynamically calculated dyadic Green's function determines the layer that can be ignored, and then modifies the first m The scope of the active layer of the source layer; after repeated iterations on the source layer until the change of the influence of all source layers causes the field change of the affected layer to be less than the specified threshold, the iteration ends. The application can reduce the complexity of three-dimensional problems and occupy memory without reducing the calculation accuracy.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method and device for iteratively solving interlayer coupling of multilayer VLSI. Background technique [0002] When the integrated circuit is working, due to the transmission of high-speed signals on its multi-layer layout, a high-frequency alternating electromagnetic field will be formed. on a small semiconductor substrate. In order to achieve more functions, VLSI has dozens to hundreds of layers of structure, each layer structure is extremely complex, integrating millions or even tens of millions of transistors, and has a multi-scale structure, from the centimeter level to the latest state-of-the-art nanoscale. In order to ensure that the integrated circuit can work normally and realize the functions designed in advance, it is necessary to ensure the power integrity and signal integrity of the integrated circuit first. Accurate analysis of power integrity and ...

AI Technical Summary

Problems solved by technology

Since the method of moments only integrates for the interface, it will reduce a large number of grid units and unknown quantities. However, since the scale of integrated circuits ranges from nanometers to centimeters, directly solving the whole integrated circuit with the finite element method itself will cause problems. Huge sparse matrix, and due to the coupling of the finite element method and the method of moments, the formed coupling matrix is ​​a dense matrix at the interface, which greatly increases the number of non-zero elements of the entire sparse matrix and the complexity of the sparse matrix solution, making the calculation time still very long

Images