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A reverse copper foil processing equipment

A processing equipment and copper foil technology, which is applied in the field of reverse copper foil processing equipment, can solve the problems of copper foil and dry film deformation, surface bonding force becomes smaller, and affect the elongation of the plate, so as to reduce the residual copper rate and reduce the pressure. tightening force, reducing deformation effect

Active Publication Date: 2021-09-21
惠州联合铜箔电子材料有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

In order to achieve the preset bonding force, in the prior art, the combination of the rough surface and the dry film is usually carried out by pressing rollers, which will cause deformation of the copper foil and the dry film, and affect the elongation of the board. Due to the large pressure on the rough surface, it is easy to produce residual copper after etching, which loses some advantages of reversed copper foil, and easily leads to a decrease in its surface bonding force.

Method used

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  • A reverse copper foil processing equipment
  • A reverse copper foil processing equipment
  • A reverse copper foil processing equipment

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Embodiment Construction

[0021] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content described in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic concept of the present invention, and the following embodiments and the features in the embodiments can be combined with each other in the case of no conflict.

[0022] Wherein, the accompanying drawings are for illustrative purposes only, and represent only schematic diagrams, rather than physical drawings, and should...

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Abstract

The invention discloses a reverse copper foil processing equipment, which belongs to the technical field of mechanical processing equipment, and comprises a copper foil composite belt, a first drive roller set for transmitting the copper foil composite belt, a dry film composite belt, and a The second drive roller set of the dry film combination belt, the dry film engraving belt and the third drive roller set used to transport the dry film engraving belt, the surface of the copper foil combination belt has a first rough texture, the The dry film imprinting belt is transmitted synchronously with the dry film combination belt. The dry film imprinting belt is used to mark the surface of the dry film combination belt into a rough surface. The copper foil combination belt and the dry film combination belt pass through a pressing mechanism Press fit. The device of the invention can increase the bonding force between the copper foil and the dry film without excessive pressing force, reduces the deformation of the material, ensures the elongation of the copper foil, and can also reduce the residual copper rate.

Description

technical field [0001] The invention belongs to the technical field of mechanical processing equipment, and in particular relates to a reverse copper foil processing equipment. Background technique [0002] One side of the electrolytic copper foil is smooth, and the other side is relatively rough. Generally, in the use of circuit boards, the roughened copper surface and the bonding surface will be bonded to make the copper foil and the bonding surface have a greater bonding force. If the rough surface is made on the surface of the circuit board, the uniform rough surface can be directly attached to the dry film, and a good bonding force can be achieved without too much pre-treatment. Therefore, manufacturers of copper clad laminates try to reverse the rough surface of the copper skin and treat the smooth surface to strengthen the bonding. This usage is the so-called usage of reversed copper foil. In order to achieve the preset bonding force, in the prior art, the combinatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/04B32B15/20B32B7/12B32B33/00B32B37/10B32B38/18
CPCB32B7/12B32B15/04B32B15/20B32B33/00B32B37/10B32B38/1825
Inventor 万新领高元亨成天耀罗志艺
Owner 惠州联合铜箔电子材料有限公司
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