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Preparation method and application of modification-free super-hydrophobic copper layer

A water-copper and super-repellent technology, applied in the direction of nanotechnology, nanotechnology, nanotechnology, etc. for materials and surface science, can solve the problems of long standing time and poor stability of hydrophobic layer, and achieve the improvement of catalytic ability and equipment Simple, avoid the effect of composite electrodeposition

Active Publication Date: 2021-05-28
SHANDONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the problem of the poor stability of the hydrophobic layer in the prior art and the need for a long standing time before it can be used, the present invention proposes a method for preparing a modification-free super-hydrophobic copper layer and its application, utilizing the carbon absorption of Cu, through The Cu layer prepared by the one-step electrodeposition method can also form a super-hydrophobic layer with a micro-nano structure without low-energy modification, realizing super-hydrophobicity. surface, the contact angle is greater than 150°, and the rolling angle is less than 10°

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  • Preparation method and application of modification-free super-hydrophobic copper layer
  • Preparation method and application of modification-free super-hydrophobic copper layer
  • Preparation method and application of modification-free super-hydrophobic copper layer

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preparation example Construction

[0027] In the first aspect of the present invention, a method for preparing a modification-free superhydrophobic copper layer is provided, comprising:

[0028] Pretreatment of the steel substrate;

[0029] Preparation of electrodeposition solution: mix copper salt solution and potassium sodium tartrate solution, and then add sodium hydroxide to obtain it;

[0030] Electrodeposition process: use electrodeposition technology to deposit electrodeposition solution on the metal surface to form a biomimetic micro-nano structure copper layer; then place the metal at room temperature to obtain a modification-free super-hydrophobic copper layer.

[0031] In one or more embodiments of the present invention, the pre-treatment includes sanding, surface alkali cleaning and degreasing, and pickling activation treatment;

[0032] Preferably, the steel sample is smoothed with water sandpaper, and then the surface is subjected to alkali cleaning and degreasing and acid cleaning and activation...

Embodiment 1

[0054] The preparation method of superhydrophobic Cu electrodeposition layer in the present embodiment, comprises following several steps successively:

[0055] (1) Select X90 pipeline steel (20×50×3mm) as the base sample, pure copper plate (20×50×5mm) as the counter electrode sample, and polish the processed X90 pipeline steel and pure zinc sample with water sandpaper to 2000#, put the polished sample into absolute ethanol and ultrasonically clean it for 15 minutes to remove the grease and pollutants on the surface of the sample;

[0056] (2) Immerse the above-mentioned cleaned steel sample into a mixed aqueous solution containing 30g / L sodium hydroxide, 20g / L sodium carbonate, 20g / L sodium phosphate and 10g / L sodium silicate (60°C ) to remove oil by alkali washing for 15 minutes. 2 SO 4 Pickling and activation in aqueous solution (room temperature) for 15s, cleaning and drying after taking out, in order to improve the binding force between the composite electrodeposited la...

Embodiment 2

[0063] The preparation method of superhydrophobic Cu electrodeposition layer in the present embodiment, comprises following several steps successively:

[0064] (1) Select X90 pipeline steel (20×50×3mm) as the base sample, pure copper plate (20×50×5mm) as the counter electrode sample, and polish the processed X90 pipeline steel and pure zinc sample with water sandpaper to 2000#, put the polished sample into absolute ethanol and ultrasonically clean it for 15 minutes to remove the grease and pollutants on the surface of the sample;

[0065] (2) Immerse the above-mentioned cleaned steel sample into a mixed aqueous solution containing 40g / L sodium hydroxide, 25g / L sodium carbonate, 25g / L sodium phosphate and 15g / L sodium silicate (60°C ) to remove oil by alkali washing for 15 minutes. 2 SO 4 Pickling and activation in aqueous solution (room temperature) for 15s, cleaning and drying after taking out, in order to improve the binding force between the composite electrodeposited la...

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Abstract

The invention belongs to the field of metal material surface modification, and particularly relates to a preparation method and application of a super-hydrophobic copper layer on a steel substrate. The preparation method of the modification-free super-hydrophobic copper layer comprises the following steps of: carrying out pre-treatment on the steel substrate; preparing an electro-deposition solution, namely mixing copper salt solution and potassium sodium tartrate solution, and then adding sodium hydroxide to obtain the electro-deposition solution; and executing electro-deposition process: depositing the electro-deposition solution on the metal surface by utilizing an electro-deposition technology to form a bionic micro-nano structure copper layer; and then placing the metal under the room temperature condition to obtain the modification-free super-hydrophobic copper layer. By reasonably selecting the type and composition of deposited metal, it is found for the first time that under the condition of reasonable electro-deposition parameters, electro-deposition of copper metal on metal can form the bionic micro-nano structure copper layer, and the metal surface is endowed with excellent hydrophobic performance.

Description

technical field [0001] The invention belongs to the field of surface modification of metal materials, and in particular relates to a method for preparing a superhydrophobic copper layer on a steel substrate and its application, in particular to a technique for preparing a modification-free superhydrophobic copper layer on a steel substrate by simple electrodeposition and its application . Background technique [0002] The information disclosed in this background section is only intended to increase the understanding of the general background of the present invention, and is not necessarily taken as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. [0003] Due to the large use of fossil fuels and the ability to absorb a large amount of CO 2 of forests are destroyed, CO in the atmosphere 2 Concentrations continue to rise, and thus trigger the greenhouse effect. By dissolving CO in aqueous s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/36C23G1/19B82Y30/00B82Y40/00
CPCC25D3/38C25D5/36C23G1/19B82Y30/00B82Y40/00
Inventor 李好李鹏昌辛蕾彭玉洁于青王忠卫
Owner SHANDONG UNIV OF SCI & TECH
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