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Multi-curing adhesive and preparation method thereof

A multiple curing and adhesive technology, applied in the direction of adhesives, adhesive additives, non-polymer organic compound adhesives, etc., can solve the problems of high complexity, low use efficiency, monotonous curing method of a single adhesive, etc. , to reduce complexity and improve efficiency

Pending Publication Date: 2021-05-14
深圳市汇海鑫科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in traditional adhesives, the curing method of a single adhesive is relatively monotonous, and only specific adhesives can be used in various scenarios, which is complicated to use and low in efficiency.

Method used

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  • Multi-curing adhesive and preparation method thereof
  • Multi-curing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The formula used includes: 23% of acrylic oligomer, 15% of polyurethane oligomer, 15% of isobornyl acrylate, 15% of acrylic monomer, 2.5% of carbon nanotube, 0.5% of graphene, 4-(1-oxo- 2-propenyl)morpholine 10%, (2,4,6-trimethylbenzoyl)diphenylphosphine oxide 2.5%, phenylbis(2,4,6-trimethylbenzoyl)oxidation Phosphine 2.5%, (2-ethylhexanoic acid) tert-butyl peroxide 1.3%, p-hydroxyanisole 0.2%, (methoxycarbonylaminomethyl) trimethoxysilane 2.5%, organic fluorescent toner 2%, 3% of polyethylene wax, 2% of nano-alumina powder, 2% of nano-titanium oxide powder, and 2% of nano-silicon dioxide, and sample 1 was produced.

Embodiment 2

[0034] The formula used includes: 21% acrylic oligomer, 19% polyurethane oligomer, 13% isobornyl acrylate, 15% acrylic monomer, 2.5% carbon nanotube, 0.5% graphene, 4-(1-oxo- 2-propenyl)morpholine 10%, (2,4,6-trimethylbenzoyl)diphenylphosphine oxide 2.5%, phenylbis(2,4,6-trimethylbenzoyl)oxidation Phosphine 2.5%, (2-ethylhexanoic acid) tert-butyl peroxide 1.3%, p-hydroxyanisole 0.2%, (methoxycarbonylaminomethyl) trimethoxysilane 2.5%, organic fluorescent toner 2%, 3% of polyethylene wax, 2% of nano-alumina powder, 2% of nano-titanium oxide powder, and 2% of nano-silicon dioxide, and sample 2 was produced.

Embodiment 3

[0036]The formula used includes: 22% acrylic oligomer, 11% polyurethane oligomer, 19% isobornyl acrylate, 17% acrylic monomer, 2.5% carbon nanotube, 0.5% graphene, 4-(1-oxo- 2-propenyl)morpholine 9%, (2,4,6-trimethylbenzoyl)diphenylphosphine oxide 2.5%, phenylbis(2,4,6-trimethylbenzoyl)oxidation Phosphine 2.5%, (2-ethylhexanoic acid) tert-butyl peroxide 1.3%, p-hydroxyanisole 0.2%, (methoxycarbonylaminomethyl) trimethoxysilane 2.5%, organic fluorescent toner 2%, 3% of polyethylene wax, 2% of nano-alumina powder, 2% of nano-titanium oxide powder, and 2% of nano-silicon dioxide, to produce sample 3.

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Abstract

The invention provides a multi-curing adhesive and a preparation method thereof. The multi-curing adhesive comprises the following components in percentage by mass: 10-25% of an acrylic oligomer, 10-25% of a polyurethane oligomer, 10-25% of a reactive diluent, 5-20% of a high glass transition temperature monomer, 2.5-10% of a photocuring catalyst, 3-5% of a photoinitiator, 1-1.5% of a thermal initiator, 0.05-0.2% of a polymerization inhibitor, 0.5-2.5% of a coupling agent and 1-2% of fluorescent toner. The coating comprises the following components in percentage by weight: 0.7-5% of a mechanical modifier, 0.2-2% of a toner, 0.2-2% of a thixotropic agent, 0.5-4% of carbon nanotubes and 0.1-1% of graphene. The adhesive prepared by the invention can use a plurality of curing modes, radiation curing is used as a main mode, and heating curing is used as an auxiliary mode.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a multi-curing adhesive and a manufacturing method thereof. Background technique [0002] Adhesive refers to the technology of connecting the surfaces of homogeneous or heterogeneous objects with adhesive, which has the characteristics of continuous stress distribution, light weight and low process temperature. Gluing is especially suitable for the connection of different materials, different thicknesses, ultra-thin specifications and complex components. Glue is developing the fastest in modern times and has a wide range of application industries. There are many classification methods of adhesives, which can be divided into thermosetting type, hot melt type, room temperature curing type, pressure sensitive type, etc. according to the application method; according to the application object, it can be divided into structural type, non-configuration or special adhesive; the conne...

Claims

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Application Information

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IPC IPC(8): C09J4/06C09J4/02C09J11/04C09J11/08C09J11/06
CPCC09J4/06C09J11/04C09J11/08C09J11/06
Inventor 徐嘉鹏陈晓宁
Owner 深圳市汇海鑫科技有限公司
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