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Special organic carrier for front silver paste for fine textured silicon wafer

A technology of organic carrier and silicon wafer, which is applied in the direction of semiconductor devices, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc. Chip production yield reduction and other issues

Inactive Publication Date: 2021-05-11
上海银浆科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the surface roughness of the fine-textured silicon wafer is low, which is not conducive to the adhesion of the front silver paste on the silicon wafer. The pr

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  • Special organic carrier for front silver paste for fine textured silicon wafer
  • Special organic carrier for front silver paste for fine textured silicon wafer
  • Special organic carrier for front silver paste for fine textured silicon wafer

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Abstract

The invention discloses a special organic carrier for front silver paste for a fine textured silicon wafer, which is characterized in that the organic carrier consists of an organic carrier V1 and an organic carrier V2. The organic carrier V1 comprises the following components: an organic resin binder, a thixotropic agent, a dispersing agent and an organic solvent; the organic carrier V2 comprises the following components: a thermoplastic elastomer, a tackifier and an organic solvent. According to the special organic carrier for the front silver paste for the fine suede silicon wafer provided by the invention, one part of the special organic carrier provides rheological properties necessary for screen printing of the front silver paste; and the other part can improve the adhesive force between the silver paste and the fine suede silicon-based material in the printing process and reduce the printing defects.

Description

technical field [0001] The invention relates to a special organic carrier for front silver paste for fine-textured silicon wafers, in particular to a preparation method of the special carrier and a corresponding preparation method for front silver paste for fine-textured silicon wafers and solar cell electrodes. Background technique [0002] As a new energy technology with the fastest development speed, the lowest cost and the highest degree of industrialization, crystalline silicon solar cells have become the absolute mainstream of solar energy utilization and development. In recent years, with the reduction of new energy subsidies, the intensification of competition, and the pressure on the cost of solar power generation, the market has increasingly higher requirements for the photoelectric conversion efficiency of solar cells. [0003] According to the photoelectric conversion theory of crystalline silicon solar cells, reducing the reflectivity of incident sunlight is the...

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Application Information

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IPC IPC(8): H01B1/22H01L31/0224
CPCH01B1/22H01L31/022425
Inventor 王亮乔亮陈小龙
Owner 上海银浆科技有限公司
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