Diamond wire cutting circulating system

Abstract

The invention discloses a diamond wire cutting circulating system. The diamond wire cutting circulating system comprises a diamond wire cutting machine, a filtering device, a liquid conveying pipeline, a liquid storage tank, a cutting base plate and circulating liquid, wherein the cutting base plate is an antibacterial cutting base plate; the circulating liquid is obtained by mixing silicon powder generated by cutting, base plate powder and weakly acidic cutting liquid and then filtering the mixture through the filtering device, and is weakly acidic and low-conductivity antibacterial circulating liquid. The circulating system is high in stability, low in silicon wafer edge breakage rate and low in diamond cutting line clamping rate and breaking rate, pollution and blockage caused by flora breeding are not likely to happen, the process is simplified, cost is reduced, and high popularization significance is achieved.

Description

technical field [0001] The invention relates to a cutting circulation system, in particular to a diamond wire cutting circulation system. Background technique [0002] Diamond wire cutting technology is the preferred processing method for wire cutting processing of non-conductive materials. With the development of diamond wire cutting technology, the cutting backing plate has gradually developed from glass and resin materials to today's plastic materials, which are easier to cut through and lower in production cost. With the promotion and use of plastic backing boards, new problems have emerged. The cutting environment is weakly acidic, and the powder dropped during cutting is easy to form bacterial colonies in a weak acid-washing environment, and the secretions of the bacterial colonies will form A large number of flocs will block and pollute the condensation module, infusion pipeline and liquid storage tank, which will cause the diamond wire cutting system to need to be c...

AI Technical Summary

Problems solved by technology

With the promotion and use of plastic backing boards, new problems have emerged. The cutting environment is weakly acidic, and the powder dropped during cutting is easy to form bacterial colonies in a weak pickling environment, and the secretions of the bacterial colonies will form A large number of flocs will block and pollute the condensation module, infusion pipeline and liquid storage tank, which will cause the diamond wire cutting system to need to be cleaned frequently

[0003] In the prior art, the sticky glue used for configuring the circulating fluid is alkaline sticky sticky glue with a pH of 9.5-10, and the PH value of the configured circulating fluid rises to a large extent during the cutting process, and the silicon powder produced by cutting will react with the alkali Heat release, which in turn causes the circulating fluid after cutting to pass through the filter device, which brings safety hazards such as burning through the filter cloth in the process of pressing the silica mud and catching fire during the transportation of the silica mud

And in order to maintain the weakly acidic cutting environment during the cutting process, it is necessary to continuously drop citric acid during the cutting process to reduce the pH value of the circulating fluid, and the addition of citric acid increases the conductivity of the circulating fluid at the same time, improving the quality of silicon wafers. If the fouling rate is high, it is necessary to add an ion exchange column and increase the amount of supplementary and replacement pure water to maintain the conductivity of the system within a stable range, which increases the construction process and cost

In addition, the continuous dripping of citric acid during the cutting process increases the instability of the system, which is likely to cause chipping of the silicon wafer cutting and the jamming and breaking of the diamond wire

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