Wafer cutting fluid

Abstract

The invention discloses wafer cutting fluid, belonging to the field of surface precision machining of photoelectronic devices. An oligomeric soap compound in the cutting fluid is ionized in a solution to form a negative charge group, and also has an amphiphilic structure similar to a surfactant, so the oligomeric soap compound can form a directionally arranged adsorption layer on the surface of a wafer, the negative charge group faces outwards and form a repulsive force with silicon chips having negative charges; and therefore, direct contact between the silicon chips and the surface of the wafer is prevented, and pollution of the silicon chips to the wafer is avoided. Meanwhile, a natural plant extract adopted in the cutting fluid is a compound with a heterocyclic structure having one or more N atoms or S atoms, electrons on a metal surface can be bonded more easily through the N or S atoms in the heterocyclic structure, so a protective film is formed, and electrochemical corrosion of a bonding pad on the surface of the semiconductor wafer is inhibited.

Description

technical field [0001] The invention relates to a wafer cutting fluid, which belongs to the field of surface precision processing of optoelectronic devices. Background technique [0002] In the semiconductor chip manufacturing process, the cutting process of the semiconductor wafer refers to a process in which the neatly distributed chips on the semiconductor wafer are separated by cutting the area called the dicing line after the semiconductor chip circuit manufacturing process is completed. . Observing under a 30x microscope, it can be found that the wafer semiconductor is composed of a collection of many independent units. These independent units are arranged neatly in rows or columns, and there is a "groove"-shaped strip between each row or column. These "grooves" are called cutting lines. After the cutting process is completed, individual tiny chips can be obtained. [0003] Usually thousands of chips are integrated on a semiconductor wafer, which is divided into ind...

AI Technical Summary

Problems solved by technology

However, this method can only wash away larger particles, and there are still some fine silicon residues that cannot be washed away.

To make matters worse, water coolant can cause static buildup, causing residue / particle buildup in the weld zone, which will also cause metal corrosion

Corrosion can damage the solder pads, resulting in poor bonding, poor reliability, or even device failure

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