A preparation method of high thermal conductivity graphite airgel-based composite thermal interface material

A technology of high thermal conductivity graphite and thermal interface materials, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., and can solve problems such as low elastic modulus, reduced contact thermal resistance, and large elastic modulus

Active Publication Date: 2022-02-11
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Vertically aligned graphene can be obtained by using the above physical methods, but its elastic modulus is very large. An ideal thermal interface material needs to have the characteristics of low elastic modulus so that it can fully contact with heating elements and radiators and reduce contact heat. resistance, reducing the overall thermal resistance of thermal interface materials, so it is necessary to explore a new method or preparation process to obtain a graphene flexible film with high thermal conductivity

Method used

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  • A preparation method of high thermal conductivity graphite airgel-based composite thermal interface material
  • A preparation method of high thermal conductivity graphite airgel-based composite thermal interface material
  • A preparation method of high thermal conductivity graphite airgel-based composite thermal interface material

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Embodiment 1

[0032] In this embodiment, the injection molding method is used to prepare graphene airgel / polymer composite flexible heat-conducting film, and its preparation method is as follows:

[0033] (1) Weigh 0.516 g of ascorbic acid, and add 13.5 mL of deionized water into a beaker.

[0034] (2) Place the beaker containing the ascorbic acid solution on a magnetic stirrer, and at the same time, add 1.5 ml of GO aqueous solution with a concentration of 10 mg / mL to the centrifuge tube with a pipette gun. The stirring time was 10 min to ensure that the GO aqueous solution and the ascorbic acid solution were mixed evenly.

[0035] (3) Transfer the uniformly mixed salt solution in step (2) to the reaction kettle, and place the reaction kettle in a blast drying oven at 120° C. for 12 hours.

[0036] (4) Transfer the reaction product obtained in step (3) to a centrifuge tube, rinse with deionized water and ethanol three times respectively.

[0037] (5) Place the sample cleaned in step (4) ...

Embodiment 2

[0044] In this embodiment, the injection molding method is used to prepare graphene airgel / polymer composite flexible heat-conducting film, and its preparation method is as follows:

[0045] (1) Weigh 0.516 g of ascorbic acid, and add 11.5 mL of deionized water into a beaker.

[0046] (2) Place the beaker containing the ascorbic acid solution on a magnetic stirrer, and at the same time, add 4.5 ml of GO aqueous solution with a concentration of 10 mg / mL to the centrifuge tube with a pipette gun. The stirring time was 60min to ensure that the GO aqueous solution and the ascorbic acid solution were mixed evenly.

[0047] (3) Transfer the uniformly mixed salt solution in step (2) to the reaction kettle, and place the reaction kettle in a blast drying oven at 180° C. for 2 hours.

[0048] (4) Transfer the reaction product obtained in step (3) to a centrifuge tube, rinse with deionized water and ethanol three times respectively.

[0049] (5) Place the sample cleaned in step (4) an...

Embodiment 3

[0056] In this embodiment, the injection molding method is used to prepare graphene airgel / polymer composite flexible heat-conducting film, and its preparation method is as follows:

[0057] (1) Weigh 0.516 g of ascorbic acid, and add 7.5 mL of deionized water into a beaker.

[0058] (2) Place the beaker containing the ascorbic acid solution on a magnetic stirrer, and at the same time, add 7.5 ml of GO aqueous solution with a concentration of 10 mg / mL to the centrifuge tube with a pipette gun. The stirring time was 120min to ensure that the GO aqueous solution and the ascorbic acid solution were mixed evenly.

[0059] (3) Transfer the uniformly mixed salt solution in step (2) to the reaction kettle, and place the reaction kettle in a blast drying oven at 180° C. for 2 hours.

[0060] (4) Transfer the reaction product obtained in step (3) to a centrifuge tube, rinse with deionized water and ethanol three times respectively.

[0061] (5) Place the sample cleaned in step (4) an...

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Abstract

The invention discloses a preparation method of a graphite airgel-based composite thermal interface material with high thermal conductivity, relating to the thermal interface material. The method comprises the following steps: adding ascorbic acid into deionized water, stirring to obtain a uniform ascorbic acid solution; stirring and adding GO aqueous solution, transferring the obtained mixed solution to the lining of the reaction kettle, sealing it and putting it into a stainless steel shell, and placing it in a blast drying oven Reaction; the reaction product is transferred from the reactor lining to other containers, and washed repeatedly with deionized and ethanol; the cleaned sample is frozen, and then transferred to a freeze dryer for drying; the sample is placed in a mold, and the sample is compressed with a certain pressure , and then pour the prepared polymer solution into the mold; place it in a vacuum drying oven to dry; the dried sample is demolded from the mold to obtain a high thermal conductivity graphite airgel-based composite thermal interface material. With high longitudinal thermal conductivity, good mechanical properties, self-supporting and easy storage, it is expected to solve the bottleneck problem of heat dissipation in electronic products.

Description

technical field [0001] The invention relates to a thermal interface material, in particular to a preparation method of a graphite airgel-based composite thermal interface material with high thermal conductivity. Background technique [0002] High temperatures will have a detrimental effect on the stability, reliability and life of electronic components. Ensuring that the heat generated by heating electronic components can be discharged in a timely manner has become an important aspect of the system assembly of microelectronics products. For portable electronic products with high integration and assembly density, heat dissipation has even become the technology of the entire product. Bottleneck problem. In recent years, in the field of microelectronics, a new discipline - Thermal Management (Thermal Management) has been gradually developed, which specializes in the safe heat dissipation methods, heat dissipation equipment and materials used in various electronic equipment; am...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L83/04C08L63/00C08K7/24H05K7/20
CPCC08J5/18H05K7/2039C08J2383/04C08J2363/00C08K7/24
Inventor 张学骜郭晓晓张宇锋程书建蔡加法
Owner XIAMEN UNIV
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