Negative-pressure phase-change heat dissipation device and high-heat-flux electronic chip simulation heat dissipation system

Abstract

The invention discloses a negative-pressure phase-change heat dissipation device and a high-heat-flux electronic chip simulation heat dissipation system, which utilize boiling coupling film evaporation to use a water working medium to generate phase change in a negative pressure environment, so as to realize efficient heat dissipation of a chip, and solve the problems that a liquid supply channel and a gas separation channel of an existing chip cold plate are mixed and the heat transfer capacity is low. A negative pressure environment is generated on one side of an evaporation waterproof breathable film, the pressure difference between the two sides of the film is increased, on one hand, mutual interference of traditional boiling heat exchange gas separation and liquid supply is avoided, on the other hand, the evaporation power and speed of the liquid are enhanced, the working efficiency of the cold plate is remarkably improved by utilizing a film evaporation mechanism, and the heat dissipation requirement that the heat flux density exceeds 1 kW / cm<2> can be met.

Description

technical field [0001] The invention relates to the field of thin-film phase-change heat transfer in tiny spaces in micro-nano heat transfer, in particular to a negative-pressure phase-change heat dissipation device and a high heat flux density electronic chip simulation heat dissipation system. Background technique [0002] With the continuous upgrading and development of today's electronic products, the number of transistors per unit area has doubled, and the power consumption of devices and equipment is getting higher and higher, which puts forward higher requirements for the heat dissipation capacity of new chip cooling devices. Traditional aluminum-based or copper-based cold plates rely solely on heat conduction and air convection to dissipate heat, which has limited heat dissipation capability and prominent local hot spots, which greatly affect the performance of high-power chips. Boiling heat transfer relies on the latent heat of phase change absorbed by liquid vapori...

AI Technical Summary

Problems solved by technology

Traditional aluminum-based or copper-based cold plates rely solely on heat conduction and air convection to dissipate heat, which has limited heat dissipation capacity and prominent local hot spots, which greatly affect the performance of high-power chips

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