Ramp sheet resistance type metallized film evaporation device

Abstract

A ramp sheet resistance type metallized film evaporation device comprises a box body, a metal film main body penetrates through the top of the interior of the box body, and the two ends of the metal film main body are connected with traction mechanisms; the side wall of the box body communicates with a vacuum pump; an evaporation mechanism is mounted at the bottom of the interior of the box body, and is horizontally arranged at the bottom of the metal film main body; the evaporation mechanism is used for evaporating a metal agent on the metal film main body; and a first sealing mechanism and a second sealing mechanism are symmetrically arranged at the top of the interior of the box body. According to the ramp sheet resistance type metallized film evaporation device, the metal film can be subjected to dust removal and impurity removal treatment, the attaching effect on the metal film and an evaporation material is improved, and the uniformity and stability of an evaporation layer are improved; and the second sealing mechanism can cool the metal film, so that the evaporated film can be cooled by metal, the conductivity of the metal film can be effectively ensured, and the metal film is prevented from being damaged by heat.

Description

technical field [0001] The invention belongs to the technical field of processing metallized film capacitors, in particular to a metallized film vapor deposition device with gradient square resistance. Background technique [0002] The main structure between the gradient resistance metallized film and the traditional metal film is the same. The square resistance of the gradient square resistance metallized polypropylene film in the normal area gradually increases from the thickened area to the edge (the thickness of the metal layer gradually decreases), and the gradual change The resistance metallized film can adapt to the distribution trend of the current density of the capacitor plate, and achieve an approximately uniform distribution of the current density, thereby significantly improving the dielectric strength; [0003] The performance of the gradient resistance metallized film is closely related to the evaporation operation. There are many factors affecting the gradien...

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Problems solved by technology

[0003] The performance of the gradient resistance metallized film is closely related to the evaporation operation. There are many factors affecting the gradient resistance metallized film during the evaporation process, two of which are: 1. There is dust on the surface of the metal film, which causes the evaporation The adsorption of the material and the metal film decreases, and the uniformity and compactness of the evaporated material are affected, which in turn affects the conduction effect of the film; 2. The radiant heat of the evaporation source and the latent heat of phase change instantaneous when metal atoms are deposited on the surface of the organic film, It will cause the danger of overheating damage to the organic film, thereby affecting the electrical properties of the metallized film after evaporation, and in severe cases, it will cause thermal deformation of the metallized film

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