Polishing solution supply performance checking device and chemical mechanical polishing system

Abstract

The invention discloses a polishing solution supply performance checking device and a chemical mechanical polishing system. The polishing solution supply performance checking device comprises a fixed seat, a horizontal plate and a locating piece, wherein the fixed seat is detachably arranged on the peripheral wall of a polishing disk; the horizontal plate is connected to the top of the fixed seat and faces the center of the polishing disk; the locating piece is arranged at the side part of the fixed seat and positioned at the lower portion of the horizontal plate; the inner side wall of the locating piece is of a circular arc structure; and the size of the circuit arc structure is matched with the outer diameter of a polishing pad. The horizontal plate is arranged between the polishing pad and a polishing solution supply arm, polishing solution drips to the top face of the horizontal plate from the end portion of the polishing solution supply arm, and scale marks are arranged on the top face of the horizontal plate so as to measure the dripping position of the polishing solution.

Description

technical field [0001] The invention belongs to the technical field of substrate manufacturing, and in particular relates to a polishing liquid supply performance verification device and a chemical mechanical polishing system. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing belongs to the wafer manufacturing process. [0003] Chemical Mechanical Planarization (CMP) is a globally planarized ultra-precision surface processing technology. In chemical mechanical polishing, the wafer is usually attracted to the bottom surface of the ...

AI Technical Summary

Problems solved by technology

The existing measurement method has the problem of low precision, and the drop point of the polishing liquid cannot be reproduced, which affects the installation accuracy and debugging progress of the chemical mechanical polishing system to a certain extent.

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