Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the directions of printed circuits, circuit devices, printed circuits, etc., can solve the problem of avoiding electrostatic interference of circuit boards, achieve high-frequency and high-speed signal transmission, strengthen electrostatic protection, and shield electromagnetic radiation. Effect

Active Publication Date: 2021-03-19
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

People in the industry usually shield the static electricity by covering the two surfaces of the circuit board with a shielding film layer. However, the electrostatic protection effect achieved by the above method does not completely prevent the circuit board from electrostatic interference.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0025] Some embodiments of the present invention will be described in detail below in conju...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a circuit board. The circuit board comprises a circuit substrate and an outer protective layer, wherein the outer protective layer comprises a covering layer, a metal layer andan adhesive layer; the adhesive layer covers the surface and the side face of the circuit substrate; the adhesive layer is a conductive adhesive; the metal layer covers the side, away from the circuitsubstrate, of the adhesive layer; and the covering layer covers one side, far away from the circuit substrate, of the metal layer. The invention further provides a manufacturing method of the circuitboard. The circuit board has electrostatic protection and electromagnetic shielding performance.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] With the increase of the system speed, the electromagnetic interference generated by the high-speed digital signal will not only cause serious mutual interference inside the system and reduce the anti-interference ability of the system, but also generate strong electromagnetic radiation to the outer space, causing the system to emit electromagnetic radiation. Exceeding the Electro Magnetic Compatibility (EMC) standard makes the product unable to pass the EMC standard certification. Board edge radiation is a common source of electromagnetic radiation. [0003] Electrostatic discharge refers to the charge transfer caused by objects with different electrostatic potentials approaching each other or in direct contact. Electrostatic discharge can easily damage sensitive circuit components. Especially for ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/28
CPCH05K1/0216H05K1/0259H05K3/28H05K2201/0723
Inventor 袁刚杨梅
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap