Circuit board and manufacture method thereof
A manufacturing method and circuit board technology, applied in the direction of multilayer circuit manufacturing, printed circuit components, electrical components, etc., can solve problems such as electromagnetic interference and serious noise
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[0025] figure 1 A flow chart of manufacturing a circuit board according to an embodiment of the present invention is shown. Please refer to figure 1 , in this embodiment, the manufacturing method of the circuit board includes the following steps: First, as shown in step S1, a first dielectric layer is provided, and the first dielectric layer has a first surface and a second surface. Then, as shown in step S2, at least one first groove is formed on the first surface. Next, as shown in step S3, a first circuit layer is formed on the inner wall of the first groove. Next, as shown in step S4, a second dielectric layer is formed on the first circuit layer. After that, as shown in step S5 , a second circuit layer is formed in the second dielectric layer, wherein the second dielectric layer is located between the first circuit layer and the second circuit layer.
[0026] In order to understand the manufacturing method of the circuit board of this embodiment in more detail, this e...
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