Batch leveling and slicing device for lead frame copper strips

Abstract

The invention discloses a batch leveling and slicing device for lead frame copper strips. The batch leveling and slicing device comprises a leveling unit, a slicing unit and a steering collection unit, the leveling unit is used for leveling the lead frame copper strips and comprises a first guide mechanism and a leveling mechanism, the slicing unit is arranged at one end of the leveling unit, is used for cutting the lead frame copper strips into copper sheets and comprises a strip cutting machine and a second guide mechanism, the strip cutting machine comprises a control box, the control box is provided with a cutter, and the steering collection unit is arranged at one end of the slicing unit, is used for converting the conveying direction of the lead frame copper sheets into the width direction of the lead frame copper sheets and comprises a transferring mechanism, an arranging mechanism, a horizontal moving mechanism and a conveying mechanism. According to the batch leveling and slicing device, simultaneous batch operation can be carried out on the multiple various lead frame copper strips within a certain width range, in addition, leveling operation is carried out before the slicing step, so that the slicing uniformity and flatness are improved, the copper sheets can be conveyed in the width direction after slicing, and the energy consumption used for conveying is saved.

Description

technical field [0001] The invention relates to lead frame production, in particular to a batch leveling and slicing device for lead frame copper strips. Background technique [0002] As the chip carrier of the integrated circuit, the semiconductor lead frame is a key structural component that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer leads by means of bonding materials, and forms an electrical circuit. Most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] There are two common manufacturing schemes for lead frames: etching processing and stamping processing. Among them, stamping processing has the advantage of low production cost. The existing stamping process takes copper strip as raw material, which is cut by a slicer and then punched by a punching machine, flattened and then surface treated. [0004] However, if it ...

AI Technical Summary

Problems solved by technology

[0004] However, if the leveling is carried out after slicing and stamping, the quality of the copper sheet cannot be guaranteed before stamping, mainly because the copper strip is not completely flat before slicing, and the slicer will make the thickness of each copper sheet The length is not uniform, or the cut surface is not flat, so a device is needed to make the copper strip pass through the slicing equipment before slicing

[0005] In the existing stamping process, there is still the disadvantage of low output efficiency of copper sheets. The production line can only slice the single-pass copper strip, and the speed is relatively slow.

And a single production line can only slice copper strips of the same width, which has great limitations

[0006] In addition, after the copper strip is cut into copper sheets, when the copper sheets are transported to the production line of the next process along its length, each copper sheet needs to be transported with a long path, which consumes more energy for conveying the copper sheet material

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