Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A lead frame copper strip batch leveling and slicing device

A technology of slicing device and lead frame, which is applied to shearing device, feeding device, positioning device, etc., can solve the problems of large limitation, uneven cutting surface, long transportation path, etc., so as to improve the leveling quality and prevent left and right shaking. Effect

Active Publication Date: 2021-04-30
四川富美达微电子有限公司
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if the leveling is carried out after slicing and stamping, the quality of the copper sheet cannot be guaranteed before stamping, mainly because the copper strip is not completely flat before slicing, and the slicer will make the thickness of each copper sheet The length is not uniform, or the cut surface is not flat, so a device is needed to make the copper strip pass through the slicing equipment before slicing
[0005] In the existing stamping process, there is still the disadvantage of low output efficiency of copper sheets. The production line can only slice the single-pass copper strip, and the speed is relatively slow.
And a single production line can only slice copper strips of the same width, which has great limitations
[0006] In addition, after the copper strip is cut into copper sheets, when the copper sheets are transported to the production line of the next process along its length, each copper sheet needs to be transported with a long path, which consumes more energy for conveying the copper sheet material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A lead frame copper strip batch leveling and slicing device
  • A lead frame copper strip batch leveling and slicing device
  • A lead frame copper strip batch leveling and slicing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Such as Figure 1-Figure 17 A lead frame copper strip batch leveling and slicing device shown includes a leveling unit 1 and a slicing unit 2 .

[0058] The leveling unit 1 is used for leveling the copper strip of the lead frame. The leveling unit 1 includes a first guiding mechanism 11 and a flattening mechanism 12. The first guiding mechanism 11 includes a guiding table 111, and the upper end surface array of the guiding table 111 is provided with a plurality of first A guide groove 1111, a first support 1121 is provided at a predetermined distance from one end of the guide table 111, a first uniaxial cylinder 112 is provided on the first support 1121, a first horizontal plate 1122 is provided at one end of the output shaft of the first uniaxial cylinder 112, and One side of a horizontal plate 1122 is provided with a plurality of first branch rods 1123, and the lower end of one end of the first branch rod 1123 is provided with a first guide plate 113, and the bottom s...

Embodiment 2

[0064] Such as Figure 1-Figure 27 The shown batch leveling and slicing device for lead frame copper strips includes the batch leveling and slicing device for lead frame copper strips in Embodiment 1, and a turning collection unit 3 .

[0065] The turning and collecting unit 3 is arranged at one end of the slicing unit 2. The turning and collecting unit 3 includes a transfer mechanism 31, an arrangement mechanism 32, a translation mechanism 33, and a transmission mechanism 34. The transfer mechanism 31 includes a plurality of fifth supports 3111 arranged in an array, and the fifth supports 3111 The upper end is provided with a slideway 311 for sliding the copper sheet. The slideway 311 is a ramp that decreases in height from the feed end to the discharge end. Arranged in a straight array, the alignment mechanism 32 is located at one end of the transfer mechanism 31, the alignment mechanism 32 includes an alignment box 321, and one end of the alignment box 321 is arrayed with a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A lead frame copper strip batch leveling and slicing device includes a leveling unit, a slicing unit, and a turning collection unit. The leveling unit is used for leveling the copper strip of the lead frame. The leveling unit includes a first guiding mechanism and a flattening mechanism; The tape machine, the second guide mechanism, the tape cutting machine includes a control box, and the control box is equipped with a cutter; the steering collection unit is located at one end of the slicing unit, which is used to change the transportation direction of the copper sheet of the lead frame to be transported along its width direction, and turn to the collection unit Including transfer mechanism, alignment mechanism, translation mechanism, transmission mechanism. The present invention can perform multiple simultaneous batch operations on various lead frame copper strips within a certain width range, and perform a leveling operation before the slicing step to improve the uniformity and flatness of the slicing, and after slicing, the copper strips can be cut along the width Conveying in the opposite direction saves energy consumption for conveying.

Description

technical field [0001] The invention relates to lead frame production, in particular to a batch leveling and slicing device for lead frame copper strips. Background technique [0002] As the chip carrier of integrated circuits, the semiconductor lead frame is a key structural component that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] There are two common production schemes for lead frames: etching and stamping, among which stamping has the advantage of low production cost. Existing stamping processing technology is to use copper strip as raw material, after blanking with a slicer, it is stamped by a punching machine, leveled and then surface treated. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23P23/04B21D1/02B21D43/22B21D43/28B23D15/08
CPCB21D1/02B21D43/22B21D43/287B23D15/08B23P23/04
Inventor 曾尚文陈久元杨利明刘高宸
Owner 四川富美达微电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com