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Low-temperature sintered zirconia ceramic substrate

A zirconia ceramic, low-temperature sintering technology, applied in ohmic resistance heating, application, tobacco and other directions, to achieve the effects of stable use performance, reduced use cost and long service life

Inactive Publication Date: 2021-03-09
嘉兴屹飞材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a low-temperature sintered zirconia ceramic substrate, which solves the problems of the bending strength and wear resistance of the ceramic substrate

Method used

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  • Low-temperature sintered zirconia ceramic substrate
  • Low-temperature sintered zirconia ceramic substrate
  • Low-temperature sintered zirconia ceramic substrate

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Embodiment

[0030] Such as Figure 1-5 As shown, the embodiment of the present invention provides a low-temperature sintered zirconia ceramic substrate, including a zirconia ceramic substrate 1, a first insulating layer 2 is fixedly connected to the bottom of the zirconia ceramic substrate 1, and one side of the upper surface of the zirconia ceramic substrate 1 is A first metal protection sheath 9 is fixedly connected, and a first welding pad 6 is arranged inside the first metal protection sheath 9. The bottom of the first welding pad 6 is fixedly connected with a zirconia ceramic substrate 1, and the upper surface of the first welding pad 6 A first circular fixed plate 7 is fixedly connected, one side of the first circular fixed plate 7 is fixedly connected with a first lead wire 8, and the upper surface of the zirconia ceramic substrate 1 is fixedly connected with the first metal protective sheath 9 in a symmetrical position. There is a second metal protection sheath 10, the inside of t...

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Abstract

The invention provides a low-temperature sintered zirconia ceramic substrate, and relates to the field of ceramic substrates. The low-temperature sintered zirconia ceramic substrate comprises a zirconia ceramic substrate body, a first insulating layer is fixedly connected to the bottom of the zirconia ceramic substrate body, a first metal protective sleeve is fixedly connected to one side of the upper surface of the zirconia ceramic substrate body, and a first welding disc is arranged in the first metal protective sleeve; the zirconia ceramic substrate body is fixedly connected to the bottom of the first welding disc, a first circular fixing plate is fixedly connected to the upper surface of the first welding disc, and a first lead is fixedly connected to one side of the first circular fixing plate. And a second metal protective sleeve is fixedly connected to the upper surface of the zirconia ceramic substrate body and is symmetrical to the first metal protective sleeve, and a second welding disc is arranged in the second metal protective sleeve. And by using a copper oxide connecting layer, the bending strength and the wear resistance of the zirconium oxide ceramic substrate are enhanced.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to a low-temperature sintered zirconia ceramic substrate. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of a ceramic substrate (single or double-sided) at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, which has a large load-bearing capacity. flow capability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. It has the advantages of high resistance, outstanding high-frequency characteristics, high thermal conductivity, good chemical stability, shock resistance, heat resistance, pressure res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/26A24F47/00
CPCH05B3/26
Inventor 刘强
Owner 嘉兴屹飞材料科技有限公司
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