Manufacturing method of integrally-formed inductor

Abstract

The invention relates to the field of inductor manufacturing, and especially relates to a manufacturing method of an integrally-formed inductor. The method mainly comprises the following steps: S1, uniformly mixing main soft magnetic alloy powder and auxiliary soft magnetic alloy powder, and then mixing with a binder, a curing agent and acetone; S2, pressing a flat plate blank and a T-shaped blankwith preset sizes; S3, winding an enameled wire; S4, carrying out hot press molding and baking on the flat plate blank and the T-shaped blank wound with the enameled wire; S5, spraying and coating aninsulating resin protective material, and then baking; and S6, stripping the resin and the patent leather at the copper electrode, and electroplating the electrode to generate the integrally formed inductor. The technical scheme has the beneficial effects that by controlling the weight and the size of the prefabricated flat plate blank, the yield of a hot pressing link can be improved, and the cost and material waste in inductor manufacturing are reduced; and in addition, ultrasonic vibration is applied to the cold and hot pressing process, so that particles can be fully filled, inductance density is improved, and magnetic conductivity is remarkably improved.

Description

technical field [0001] The invention relates to the field of manufacturing inductors, in particular to a method for manufacturing integrally formed inductors. Background technique [0002] With the rapid development of the electronic information industry, downstream electronic devices and communication equipment are gradually developing in the direction of high frequency, small size, low voltage and high current. Low-cost, excellent shielding performance, high reliability, and suitable for high-density surface mounting, the one-piece chip inductors have been widely used in mobile communications, computers, automotive electronics, high-resolution TVs, broadcast satellites and other fields, and have gradually become the mainstream of the inductor market. . [0003] At present, there are many manufacturing processes for integrated chip inductors, but the basic method is: (1) Pre-wind the hollow coil, put the hollow coil into the mold cavity of the mold, and then fill the prepa...

AI Technical Summary

Problems solved by technology

[0004] It can be seen that in the existing manufacturing technology of integrally formed inductors, when pressing the inductor body, the powder is basically directly filled into the mold for pressing, but Production practice has proved that the existing manufacturing process of integrally formed inductors has the following defects: the soft magnetic alloy powder used for the production of integrally formed inductors will be subjected to insulation coating and granulation before pressing. Limitation, the prefabricated powder particles produced by granulation have poor uniformity in size and weight, while the production of integrated inductors basically press multiple blanks in the same mold at the same time, the inhomogeneity of prefabricated powder particles As a result, there is a large deviation in the amount of powder filled into each cavity of the mold during the molding stage, and it is not easy to control, resulting in a large size, weight and performance deviation of the pressed inductor blank, which ultimately greatly reduces the product yield. Good products already contain components such as enameled wires, which are difficult to recycle and reuse, which greatly increases the manufacturing cost

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