Laser welding solder paste and preparation method thereof
A technology of laser welding and solder paste, which is applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of solder balls and flux splashing, and the effect is not very ideal, so as to suppress spatter and flux Effect of boiling and preventing solder paste from flowing
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Embodiment 1
[0025] Embodiment 1: laser solder paste of the present invention and preparation method thereof:
[0026] The laser solder paste is composed of the following raw materials in weight percentage: 87.5% of alloy powder and 12.5% of flux; wherein the melting point of alloy powder is Sn96.5Ag3.0Cu0.5 at 217°C.
[0027] The raw material components and preparation method of the flux are as follows: 30% by weight of rosin resin KE604, 10% of rosin resin FOR AX-E, and 40% of diethylene glycol monooctyl ether are added to a heating device In a stirred reactor, heat to 165°C, stir until completely dissolved, then add 2.0% succinic acid, 5% polyamide, 3% polyamide wax, 2.0% suberic acid, 3 % of 2,3-dibromosuccinic acid and 5% of bis(2-ethylhexyl) sebacate in a container, and continue to stir, stop heating and stirring after the solid is completely dissolved, after cooling to room temperature Get a paste of flux for later use.
[0028] Add the Sn96.5Ag3.0Cu0.5 alloy powder and the flux...
Embodiment 2
[0029] Embodiment 2: laser solder paste of the present invention and preparation method thereof:
[0030] The laser solder paste is composed of the following raw materials in weight percentage: 86% of alloy powder and 14% of flux; wherein the melting point of alloy powder is Sn96.5Ag3.0Cu0.5 at 217°C.
[0031] The raw material components and preparation method of the soldering flux are as follows: 30% rosin resin KE604, 14% rosin resin FOR AX-E, 35% diethylene glycol monooctyl ether solvent are added with heating In the stirred reactor of the device, heat to 170°C, stir until completely dissolved, then add 1.0% succinic acid, 5% polyamide, 1% polyamide wax, and 2.0% suberic acid in sequence , 2% 2,3-dibromosuccinic acid and 10% azelaic acid bis(2-ethylhexyl) ester in a container, and keep stirring, stop heating and stirring after the solid is completely dissolved, and cool to After room temperature, a creamy flux is obtained for use.
[0032] Add the Sn96.5Ag3.0Cu0.5 alloy p...
Embodiment 3
[0033] Embodiment 3: laser solder paste of the present invention and preparation method thereof:
[0034] The laser solder paste is composed of the following raw materials in weight percentage: 87.5% of alloy powder and 12.5% of flux; wherein the melting point of alloy powder is Sn96.5Ag3.0Cu0.5 at 217°C.
[0035] The raw material components and preparation method of the flux are as follows: 30% by weight of rosin resin KE604, 5% of rosin resin FOR AX-E, 45.0% of diethylene glycol monooctyl ether are added to the heating device In a stirred reactor, heat to 165°C, stir until completely dissolved, then add 2.0% succinic acid, 5% polyamide, 1% polyamide, 4.0% suberic acid, 3% 2,3-dibromosuccinic acid and 5% bis(2-ethylhexyl) sebacate) in the container, and continue to stir, stop heating and stirring after the solid is completely dissolved, after cooling to room temperature Get a paste of flux for later use.
[0036] Add the Sn96.5Ag3.0Cu0.5 alloy powder and the flux obtained...
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