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Laser welding solder paste and preparation method thereof

A technology of laser welding and solder paste, which is applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of solder balls and flux splashing, and the effect is not very ideal, so as to suppress spatter and flux Effect of boiling and preventing solder paste from flowing

Pending Publication Date: 2021-01-29
苏州恩斯泰金属科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of traditional solder paste for laser welding has the following defects: it is easy to produce solder balls and flux splashes
Preheating can suppress the generation of solder balls and splashing of flux, but the effect is not very satisfactory

Method used

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  • Laser welding solder paste and preparation method thereof
  • Laser welding solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: laser solder paste of the present invention and preparation method thereof:

[0026] The laser solder paste is composed of the following raw materials in weight percentage: 87.5% of alloy powder and 12.5% ​​of flux; wherein the melting point of alloy powder is Sn96.5Ag3.0Cu0.5 at 217°C.

[0027] The raw material components and preparation method of the flux are as follows: 30% by weight of rosin resin KE604, 10% of rosin resin FOR AX-E, and 40% of diethylene glycol monooctyl ether are added to a heating device In a stirred reactor, heat to 165°C, stir until completely dissolved, then add 2.0% succinic acid, 5% polyamide, 3% polyamide wax, 2.0% suberic acid, 3 % of 2,3-dibromosuccinic acid and 5% of bis(2-ethylhexyl) sebacate in a container, and continue to stir, stop heating and stirring after the solid is completely dissolved, after cooling to room temperature Get a paste of flux for later use.

[0028] Add the Sn96.5Ag3.0Cu0.5 alloy powder and the flux...

Embodiment 2

[0029] Embodiment 2: laser solder paste of the present invention and preparation method thereof:

[0030] The laser solder paste is composed of the following raw materials in weight percentage: 86% of alloy powder and 14% of flux; wherein the melting point of alloy powder is Sn96.5Ag3.0Cu0.5 at 217°C.

[0031] The raw material components and preparation method of the soldering flux are as follows: 30% rosin resin KE604, 14% rosin resin FOR AX-E, 35% diethylene glycol monooctyl ether solvent are added with heating In the stirred reactor of the device, heat to 170°C, stir until completely dissolved, then add 1.0% succinic acid, 5% polyamide, 1% polyamide wax, and 2.0% suberic acid in sequence , 2% 2,3-dibromosuccinic acid and 10% azelaic acid bis(2-ethylhexyl) ester in a container, and keep stirring, stop heating and stirring after the solid is completely dissolved, and cool to After room temperature, a creamy flux is obtained for use.

[0032] Add the Sn96.5Ag3.0Cu0.5 alloy p...

Embodiment 3

[0033] Embodiment 3: laser solder paste of the present invention and preparation method thereof:

[0034] The laser solder paste is composed of the following raw materials in weight percentage: 87.5% of alloy powder and 12.5% ​​of flux; wherein the melting point of alloy powder is Sn96.5Ag3.0Cu0.5 at 217°C.

[0035] The raw material components and preparation method of the flux are as follows: 30% by weight of rosin resin KE604, 5% of rosin resin FOR AX-E, 45.0% of diethylene glycol monooctyl ether are added to the heating device In a stirred reactor, heat to 165°C, stir until completely dissolved, then add 2.0% succinic acid, 5% polyamide, 1% polyamide, 4.0% suberic acid, 3% 2,3-dibromosuccinic acid and 5% bis(2-ethylhexyl) sebacate) in the container, and continue to stir, stop heating and stirring after the solid is completely dissolved, after cooling to room temperature Get a paste of flux for later use.

[0036] Add the Sn96.5Ag3.0Cu0.5 alloy powder and the flux obtained...

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Abstract

The invention relates to laser welding solder paste and a preparation method thereof. According to the technical scheme, the laser welding solder paste is composed of the following raw materials in percentage by weight: 86-88% of alloy powder and 12-14% of a paste soldering flux, wherein the alloy powder is formed by mixing one or more than two kinds of tin-based alloy powder and has eutectic components; and the paste soldering flux is composed of the following raw materials in percentage by weight: 35-50% of rosin, 5-10% of a thixotropic agent, 3-6% of an organic acid active agent, 1-3% of anorganic halogen active agent, 35-45% of an organic solvent and 5-10% of a special solvent. The laser welding solder paste has the advantages that soldering flux boiling caused by rapid heating can berestrained, and the effect of restraining splashing of solder balls generated by rapid heating of solder paste and the soldering flux is achieved.

Description

technical field [0001] The invention belongs to the technical field of welding materials, in particular to a laser welding solder paste and a preparation method thereof. Background technique [0002] General electronic parts are welded by traditional methods of reflow soldering, wave soldering, and soldering iron spot welding. However, in recent years, as electronic products have become lighter, thinner, shorter and smaller, PCB circuit boards have become thinner, and some small parts are difficult to solder by the above methods. For small parts that are difficult to use traditional welding methods, the non-contact welding method of laser is used. This technology uses laser welding equipment to irradiate laser beams on the connection parts of PCB circuit boards. After the solder paste absorbs the light energy of the laser beams, the solder paste melts to realize the welding of electronic parts. The advantages of using laser welding are: fast welding of electronic parts on ...

Claims

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Application Information

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IPC IPC(8): B23K35/02B23K35/40B23K35/26
CPCB23K35/0244B23K35/40B23K35/262
Inventor 凡青松杨文勇
Owner 苏州恩斯泰金属科技有限公司
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