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Integrated circuit board surface dust-free heat dissipation and cooling assembly

A circuit board and integrated technology, which is applied in the field of dust-free heat dissipation and cooling components on the surface of integrated circuit boards, can solve problems such as waste of wind energy, affecting the service life of circuit boards, and lack of dust removal structures for equipment

Active Publication Date: 2021-01-22
磐安纵横信息科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The circuit board will generate a lot of heat during operation. To ensure the normal operation of the circuit board, high-end equipment must be equipped with circuit board heat dissipation components to ensure long-term operation of the equipment. The common heat dissipation methods of the circuit board are nothing more than water cooling and air cooling. As far as the air-cooling method is concerned, the air-cooled heat dissipation is uniform heat dissipation, and the heat generation of different components on the circuit board is different, which will not only cause waste of wind energy, but also cause local overheating of the circuit board, which seriously affects the circuit board. In addition, the wind power of air cooling is relatively slow, which can easily cause dust to fall on the surface of the circuit board, which will seriously cause short circuit damage to the circuit board. The existing equipment lacks a corresponding dust removal structure, and it is difficult to ensure the safe operation of high-end equipment.

Method used

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  • Integrated circuit board surface dust-free heat dissipation and cooling assembly
  • Integrated circuit board surface dust-free heat dissipation and cooling assembly
  • Integrated circuit board surface dust-free heat dissipation and cooling assembly

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Embodiment Construction

[0030] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0031] Such as Figure 1-Figure 8As shown, an integrated circuit board surface dust-free heat dissipation and cooling assembly according to the present invention includes a PCB board 1, a heat dissipation box 2, an air box 3 and a regulator 4, and a heat dissipation box 2 is fixed on the PCB board 1, and the heat dissipation box 2 is fixedly connected with the bellows 3 as an integral structure, the bellows 3 is also provided with a regulator 4, and a number of cooling plates 201 are fixedly connected in the cooling box 2, and the cooling plates 201 are provided with an adapter groove 202 and a cooling cover 203. The front end of 201 is provided with No. 1 pressure relief hole 204, No. 1 pressure relief hole 204 edge is fixedly connected with No. ...

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PUM

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Abstract

The invention relates to the technical field of circuit board heat dissipation, in particular to an integrated circuit board surface dust-free heat dissipation and cooling assembly which is characterized by comprising a PCB, a heat dissipation box, an air bellow and an adjuster, the heat dissipation box is fixed to the PCB through screws, the heat dissipation box and the air bellow are fixedly connected into an integrated structure, and the adjuster is further arranged in the air bellow; a plurality of heat dissipation plates are fixedly connected in the heat dissipation box, and are providedwith matching grooves and heat dissipation covers; the front end of the heat dissipation box is provided with a No.1 pressure release hole. According to the integrated circuit board surface dust-freeheat dissipation and cooling assembly, a brushless fan operates at a constant speed, cold air can flow through the heat dissipation box, so that the PCB is cooled uninterruptedly, the plurality of invert-n-shaped heat dissipation plates are arranged, so that independent flow channels can be formed in the heat dissipation box, and the heat dissipation plates and the heat dissipation covers are clamped on capacitors and resistors on the PCB, so that high-temperature elements on the PCB can be subjected to heat dissipation in a centralized manner, and the uniform temperature state of the PCB canbe kept.

Description

technical field [0001] The invention relates to the technical field of circuit board heat dissipation, in particular to an integrated circuit board surface dust-free heat dissipation and cooling component. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc., circuit boards make circuits miniaturized and intuitive, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards can be called printed circuit boards or printed circuit boards. Circuit board, and FPC circuit board, also known as flexible circuit board, is a highly reliable and excellent flexible printed circuit board ma...

Claims

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Application Information

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IPC IPC(8): H05K7/20B08B5/02B01D46/12B01D46/48B01D46/00
CPCH05K7/20136H05K7/20418H05K7/205H05K7/20145B08B5/02H05K7/20181H05K7/20209B01D46/12B01D46/48
Inventor 张美分
Owner 磐安纵横信息科技有限公司
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