Solar silicon wafer anti-light-attenuation processing feeding device and method and anti-light-attenuation processing device

Abstract

The invention relates to the technical field of solar silicon wafer production, and particularly relates to a solar silicon wafer anti-light-attenuation processing feeding device and method and a solar silicon wafer anti-light-attenuation equipment. The device comprises a feeding conveying belt, a silicon wafer limiting mechanism and a silicon wafer moving mechanism, wherein the feeding conveyingbelt and the silicon wafer limiting mechanism are both fixed on a workbench, and the output end of the feeding conveying belt is in contact with the lower surface of a solar silicon wafer; the outputend of the silicon wafer limiting mechanism is in contact with the two end surfaces of the solar silicon wafer; and the output end of the silicon wafer moving mechanism is in contact with the upper surface of the solar silicon wafer, and the output end of the silicon wafer moving mechanism is connected with the input end of the feeding conveying belt and the input end of a silicon wafer conveyingdevice. According to the device, the applicability of the whole device is improved by arranging the silicon wafer limiting mechanism, and accurate limiting of the solar silicon wafer is guaranteed.

Description

technical field [0001] The invention relates to the field of solar silicon wafer production, in particular to a solar silicon wafer anti-light decay treatment feeding device and method, and solar silicon wafer anti-light decay equipment. Background technique [0002] At present, boron-doped P-type crystalline silicon solar cells occupy more than 70% of the photovoltaic market. However, the efficiency of this type of solar cell will decrease when it is used. This phenomenon is called light-induced attenuation. Light attenuation research is to place the silicon wafer under the light source for irradiation, test its electrical properties before and after irradiation and obtain the corresponding light attenuation range. To study the light attenuation of silicon wafers, it is generally to place the silicon wafers in a light attenuation chamber that simulates a solar generator for illumination, and then test the electrical properties of the silicon wafers. When studying the light...

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Problems solved by technology

[0004] The prior art has the following deficiencies: 1. When loading solar silicon wafers, two air cylinders are used to drive the limit head to move to the position in contact with the two sides of the solar silicon wafer to limit the solar silicon wafers on the conveyor belt; When the cylinder is used to drive, the stroke of its motion and the length of the limit head connected to the cylinder are all fixed, that is, a group of cylinders and the limit head correspond to a solar silicon wafer of a size specification; When the material is limited, the length of the limit cylinder or the limit head needs to be replaced, which reduces the applicability of the entire equipment; at the same time, because the manufacturing accuracy of the cylinder is generally low, the position accuracy of the limit head is low when the cylinder drives the limit head ; It is easy to cause the limit head to deviate from the limit position and excessive contact with the solar silicon wafer to damage the solar silicon wafer or insufficient contact with the solar silicon wafer to limit the position, which is not conducive to the precise positioning of the solar silicon wafer

2. When buffering redundant positioning fixtures, first use the moving device to move the redundant positioning fixtures to the buffering station, and then use the moving device to move the positioning fixtures on the buffering station to the fixture output station when needed position; and this kind of caching method requires a moving device to carry the input and output of the positioning fixture, and the moving device needs to complete the three steps of moving down and grabbing, translational conveying and fixture falling to complete the buffering of the positioning fixture, thereby increasing the equipment. The complexity and the caching steps of the positioning fixture; at the same time, solar silicon wafers are hard and brittle materials, and the impact force generated during the process of handling, grabbing, moving up and falling may easily cause the stacked solar silicon wafers in the positioning fixture to squeeze and collide with each other ; Thereby causing the solar silicon wafer to crack, reducing the quality of the solar silicon wafer in the caching process

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