A circuit board and its method and application for preventing circuit oxidation

A circuit board and circuit technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of increased haze of circuit boards, affecting service life, affecting coating protection performance, etc., to meet low resistance or low impedance Requirements, ensuring stability and reliability, and improving the effect of oxidation resistance

Active Publication Date: 2021-06-29
深圳市顺华智显技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method for preventing circuit oxidation of this circuit board in the prior art has the following problems: there are solvent residues in the thicker coating or the bottom coating of components after spraying paint and conformal paint, and these solvent residues Substances may affect the function of the circuit board assembly. In the conductive area, if the solvent residue in the coating is not completely volatilized, it may cause failure, such as electromigration, leakage, etc., and the work of the circuit board cannot be guaranteed. stability
In addition, for devices working in a humid environment, the paint and three-proof paint coating sprayed on the circuit board may crack, which greatly affects the protective performance of the coating, resulting in problems such as corrosion and oxidation of the circuit board and affecting the service life.
At the same time, since the conformal paint and paint itself are polymer colloids, the haze and transmittance are poor. When spraying it on glass or acrylic circuit boards, the haze of the circuit board will increase, resulting in permeability and aesthetics. severely reduced

Method used

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  • A circuit board and its method and application for preventing circuit oxidation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] (1) The glass plate is used as the carrier of the circuit board, and the glass plate is sprayed and cleaned with a weak alkali cleaning solution (pH 7.1), washed with a rolling brush, rinsed with high-purity water, air-dried and dried, and set aside.

[0088] (2) The first metal film layer made of copper-nickel alloy (50% by mass of copper) is sputtered by a magnetron sputtering process on one surface of the glass plate, the thickness is 10nm, and the process conditions are: sputtering The total power of the radio source is 2kW, the argon gas pressure is 0.6Pa, and the temperature of the circuit board carrier is 150°C.

[0089] (3) The second copper film layer made of copper is electroplated by an acidic electroplating process on the surface of the first metal film layer, the thickness is 25 μm, and the process conditions are: CuSO 4 Concentration is 75g / L, H 2 SO 4 Concentration is 240g / L, chloride ion (Cl - ) concentration is 50ppm, and the temperature is 30°C.

...

Embodiment 2

[0095] (1) The glass plate is used as the carrier of the circuit board, and the glass plate is sprayed and cleaned with a weak alkali cleaning solution (pH 7.1), washed with a rolling brush, rinsed with high-purity water, air-dried and dried, and set aside.

[0096] (2) The first metal film layer made of copper-nickel alloy (50% by mass of copper) is sputtered by a magnetron sputtering process on one surface of the glass plate, the thickness is 100nm, and the process conditions are: sputtering The total power of the radio source is 2kW, the argon gas pressure is 0.6Pa, and the temperature of the circuit board carrier is 150°C.

[0097] (3) The second copper film layer made of copper is electroplated by an acidic electroplating process on the surface of the first metal film layer, the thickness is 50 μm, and the process conditions are: CuSO 4 Concentration is 75g / L, H 2 SO 4 Concentration is 240g / L, chloride ion (Cl - ) concentration is 50ppm, and the temperature is 30°C.

...

Embodiment 3

[0102] (1) The glass plate is used as the carrier of the circuit board, and the glass plate is sprayed and cleaned with a weak alkali cleaning solution (pH 7.1), washed with a rolling brush, rinsed with high-purity water, air-dried and dried, and set aside.

[0103] (2) The first metal film layer made of copper-nickel alloy (50% by mass of copper) is sputtered by a magnetron sputtering process on one surface of the glass plate, the thickness is 200nm, and the process conditions are: sputtering The total power of the radio source is 2kW, the argon gas pressure is 0.6Pa, and the temperature of the circuit board carrier is 150°C.

[0104] (3) The second copper film layer made of copper is electroplated by an acidic electroplating process on the surface of the first metal film layer, the thickness is 100 μm, and the process conditions are: CuSO 4 Concentration is 75g / L, H 2 SO 4 Concentration is 240g / L, chloride ion (Cl - ) concentration is 50ppm, and the temperature is 30°C. ...

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Abstract

The invention relates to a circuit board and its method and application for preventing circuit oxidation. The method includes: using glass, ceramics, PI, PET, PA or acrylic as a circuit board carrier; sputtering a first metal film layer on the circuit board carrier by magnetron sputtering; Electroplating the second copper film layer by an acidic electroplating method; electroplating a third metal film layer by an acidic electroplating method or sputtering a magnetron sputtering method on the second copper film layer; the thickness of the first metal film layer is 10-200nm ; The thickness of the second copper film layer is 5-100 μm; the thickness of the third metal film layer is 0.5-10 μm. The circuit board includes a circuit board carrier, and the first metal film layer, the second copper film layer and the third metal film layer are sequentially formed outward from the circuit board carrier. The method of the invention can effectively improve the anti-oxidation ability of the circuit board, thereby improving the service life and working stability and reliability of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board and its method and application for preventing circuit oxidation. Background technique [0002] As a carrier of information transmission, advertising screens are widely used. Light Emitting Diode (LED) advertising screen, also called LED advertising screen, is an electronic device that uses light emitting diode dot matrix arrangement to form the content to be displayed by controlling the lighting or extinguishing of each diode. As a modern mainstream display device, LED advertising screens have been widely used in various places such as squares, stadiums, press releases and stock exchanges. [0003] At present, for LED advertising screens, it is necessary to have the advantages of bright colors, wide dynamic range, high brightness, long life and stable and reliable work. In order to ensure that LED advertising screens and other display devices have the adv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0011
Inventor 吴贵华陈旺寿
Owner 深圳市顺华智显技术有限公司
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