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Embedded circuit board and preparation method thereof

An embedded, circuit board technology, used in printed circuit manufacturing, circuit substrate materials, multi-layer circuit manufacturing, etc., can solve problems such as expansion deformation, circuit board electronic components falling off, etc. The effect of heat dissipation

Pending Publication Date: 2021-01-08
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the long-term research and development process, the inventor of the present application found that the current circuit board will warp or expand due to the influence of temperature changes during the thermal processing process, which will cause the electronic components in the circuit board to fall off, expand and deform

Method used

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  • Embedded circuit board and preparation method thereof
  • Embedded circuit board and preparation method thereof

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0016] The terms "first" and "second" in this application are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, e...

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PUM

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Abstract

The invention relates to the technical field of circuit boards, and discloses an embedded circuit board and a preparation method thereof, and the embedded circuit board comprises: a substrate which isprovided with at least one groove body; electronic devices which are arranged in the corresponding groove bodies; and a packaging body which coats the outer surfaces of the electronic devices so as to isolate the electronic devices from the side wall of the groove bodies, wherein the packaging body is a plastic packaging material, and the plastic packaging material comprises at least one of silicon dioxide, silicon carbide, silicon nitride micro powder and crystalline silicon and a matrix. By means of the mode, the outer surface of the electronic device is coated with the packaging body madeof the plastic packaging material, the plastic packaging material has the advantages of being thermosetting, good in heat dissipation capacity, low in thermal expansion coefficient, resistant to hightemperature, good in binding force, high in reliability and the like, and therefore when the electronic device works, the temperature of the electronic device rises, and the packaging body can rapidlyrelease heat.

Description

technical field [0001] The present application relates to the technical field of circuit boards, in particular to an embedded circuit board and a preparation method thereof. Background technique [0002] The circuit board, often using the English abbreviation PCB (Printed circuit board), is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. Printed circuit boards are found in almost every electronic device. [0003] During the long-term research and development process, the inventor of the present application found that the current circuit board would warp or expand due to the influence of temperature changes during the thermal processing process, thus causing the electronic components in the circuit board to fall off, expand and deform. Contents of the invention [0004] The technical problem mainly solved by this application is to provide an embedded circuit board and a preparation met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H05K3/28H05K3/30H05K3/46
CPCH05K1/185H05K1/0271H05K1/0298H05K3/32H05K2201/0195H05K1/18H05K3/00H01L23/498H01L21/48H01L21/56H01L25/16H01L23/31H05K1/02H05K3/46H05K1/11H05K3/42H05K3/30H05K3/28H05K1/03H01L25/00H05K3/22H05K3/40H05K1/09H01L23/142H01L23/49822H01L23/49827H01L23/5389H05K1/188H05K3/06H05K3/4602H05K2201/0317H05K2201/0338H05K1/165H05K2201/086H05K3/188H05K2203/0723H05K2201/09063H05K2201/09072H05K1/111H05K1/115H05K1/183H05K3/061H05K3/143H05K3/146H05K3/16H05K3/4038H05K2201/0183H01F27/06H01F27/24H01F27/324H01F41/127H01F2027/065
Inventor 黄立湘王泽东缪桦
Owner SHENNAN CIRCUITS
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