Cooling liquid collecting and separating device of diamond wire silicon wafer cutting machine
A separation device and cooling liquid technology, applied in the direction of fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of high cost, inability to collect cooling liquid and silicon powder, etc., and achieve the effect of saving resources and costs
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] see Figure 1-6 , a coolant collection and separation device for a diamond wire silicon wafer cutting machine, comprising a support foot 1, the top of the support foot 1 is rotatably connected to a filter box 2 through a bearing, and a filter hole is provided on the side wall of the filter box 2, and a filter layer is installed in it 7, and the left side of the filter box 2 is located between the filter layer 7 and the bottom plate 6, and a water outlet...
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