Two-phase immersed liquid cooling case based on thermoelectric refrigeration

Abstract

The invention belongs to the technical field of heat dissipation of electronic components, and provides a two-phase immersed liquid cooling case based on thermoelectric refrigeration. Heat generated in the working process of the battery is taken away by vaporization of the fluorinated liquid on the surfaces of electronic components such as a CPU, finally the heat is transferred to the external environment through the thermoelectric refrigeration system, and therefore the electronic components such as the CPU are in a proper working temperature range. Compared with a traditional cooling mode, the liquid cooling case disclosed in the invention is advantageous in that the phase change of the fluorinated liquid is fully utilized to absorb heat generated by the battery during working, no contact thermal resistance exists, the heat taking capacity is high, and the heat dissipation efficiency is high; the filled glass beads occupy the vast majority of gap space, so that the dosage of the fluorination liquid is reduced to the minimum, and the cooling cost is greatly reduced; the thermoelectric refrigeration sheet is adopted to condense the fluorinated liquid steam, the condensation temperature is easy to control, and refrigerant pollution is prevented.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic components, and in particular relates to a two-phase submerged liquid-cooled cabinet based on thermoelectric refrigeration. Background technique [0002] With the continuous progress and development of microelectronics technology, electronic chips are becoming smaller and more integrated. High integration makes the power consumption of the chip more and more large. According to statistics, the heat flux density on the surface of some electronic devices has exceeded 1×10 6 W / m 2 ; While electronic devices need a reliable working temperature, some studies have shown that if the operating temperature of electronic devices increases by 10°C, their reliability will drop by half; the higher the temperature, the easier it is for electronic devices to fail. An increase of 10°C will double the failure rate. For silicon core components, if the temperature exceeds 170°C, the device ...

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Problems solved by technology

At present, the mainstream heat dissipation method of desktop CPU is fan plus aluminum fins, but this heat dissipation method can no longer meet the heat dissipation requirements of CPU.

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