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Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof

An electronic chip and cooling device technology, applied in cooling/ventilation/heating transformation, circuits, electrical components, etc., can solve the problems of difficult to achieve chip-level integration, complex structure, etc., achieve high-efficiency chip local adaptive adjustment, convenient production, Simple effect of structure and flow organization

Active Publication Date: 2021-01-05
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem solved by the present invention is to provide an electronic chip self-adaptive microchannel cooling device and its manufacturing method, which solves the problem of complex structure and difficult chip-level integration existing in traditional self-adaptive microchannels

Method used

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  • Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof
  • Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof
  • Electronic chip self-adaptive micro-channel cooling device and manufacturing method thereof

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Embodiment

[0044] combine figure 1, an adaptive microchannel cooling device for electronic chips, which includes a square silicon chip with a microchannel structure on one side for simulating an actual chip, a hydrogel microvalve 2, a manifold distributor / collector 3, and a sealing film layer 6 , Hollow slot 7, PCB8 and substrate 9. The hydrogel microvalve 2 is integrated in the microchannel, and the manifold distribution / collector 3 is arranged above the microchannel and connected with the microchannel to realize distribution of working fluid to the microchannel and recovery of working fluid discharged from the microchannel , A rubber film is used to seal between the manifold distributor / collector 3 and the microchannel.

[0045] Nine parallel microchannels are processed in the center of one side of the analog chip 1 by deep reactive ion etching technology, occupying a total area of ​​10.6mm×10.4mm, with a depth of 0.22mm and a rectangular cross-section. Four microcolumn structures 10...

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Abstract

The invention discloses an electronic chip self-adaptive micro-channel cooling device and a manufacturing method thereof.The electronic chip self-adaptive micro-channel cooling device comprises an analog chip with one face provided with a micro-channel structure, a hydrogel micro-valve, a manifold distributor / collector, a sealing film layer, a PCB and a substrate. The hydrogel micro-valve realizesintelligent regulation and control on the flow of the micro-channel through the change of the volume of the hydrogel micro-valve along with the thermal load. When the self-adaptive micro-channel cooling device is manufactured, firstly, the micro-channel structure and the metal coating are machined, molten paraffin is filled, the periphery of the micro-column structure is embossed with the hydrogel micro-valve outline, then the embossed outline is filled with the hydrogel solution, paraffin is cleaned after polymerization is completed, and the hydrogel micro-valve integrated in the channel isobtained. Finally, the components are pressed and compacted. The micro-channel cooling device is simple in structure and easy to manufacture in batches, has a good flow adjusting effect, and can solvethe problems of pump power waste and cooling economy of traditional micro-channel cooling.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation, in particular to an electronic chip self-adaptive microchannel cooling device and a manufacturing method thereof. Background technique [0002] With the continuous improvement of the integration of electronic chips, the heat dissipation problems they face are becoming more and more serious. Natural convection, forced air cooling and other methods cannot meet the heat dissipation requirements of high heat flux electronic chips. Compared with air-cooled technology, water-cooled technology represented by micro-channel heat sink has a larger convective heat transfer area and a higher convective heat transfer coefficient, and has received extensive attention in recent years. Another key to the cooling of electronic chips is to reduce the thermal resistance from the heat generating node to the channel wall. The substrate-embedded microchannel directly processes the microchannel structure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/473H05K7/20
CPCH01L23/367H01L23/473H05K7/205
Inventor 宣益民李修
Owner NANJING UNIV OF SCI & TECH
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