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Manufacturing method of thermopile sensor

A technology for thermopile sensors and manufacturing methods, which is applied in the field of manufacturing thermopile sensors, can solve problems such as device precision needs to be improved, and achieve the effects of reducing process costs, simplifying process flows, and improving measurement accuracy

Active Publication Date: 2020-12-22
NINGBO SEMICON INT CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the device accuracy of existing thermopile sensors needs to be improved

Method used

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  • Manufacturing method of thermopile sensor
  • Manufacturing method of thermopile sensor
  • Manufacturing method of thermopile sensor

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Embodiment Construction

[0013] It can be known from the background art that the device precision of the existing thermopile sensor needs to be improved.

[0014] Thermopile sensors are also called thermopile infrared detectors. Traditional thermopile sensors deposit polysilicon or metal on a dielectric film to make thermocouples to sense temperature information, and then use the method of anisotropic wet etching of silicon on the back A thermal insulation cavity is formed under the dielectric film to increase thermal resistance, and the thermocouple pair is electrically connected to the circuit structure on the side of the thermocouple pair, so as to realize the transmission of induction signals. However, there is no substrate under the device formed by this method for sealing, and the heat in the heat-insulating cavity will still be lost in a certain form, resulting in low measurement accuracy of the thermopile sensor.

[0015] In order to solve the above-mentioned technical problem, the embodiment ...

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Abstract

A manufacturing method of a thermopile sensor comprises the steps of: providing a thermopile structure plate and a substrate, and forming a thermopile structure on the thermopile structure plate; forming a first interconnection layer on the thermopile structure plate, wherein at least a first conductive interconnection structure electrically connected with the thermopile structure is formed in thefirst interconnection layer; forming a support structure on the substrate, forming a sacrificial structure in the support structure, and exposing the sacrificial structure from the top surface of thesupport structure; bonding the thermopile structure plate on the support structure, so that the first interconnection layer is positioned below the thermopile structure, and after bonding, the thermopile structure is arranged above the sacrificial structure; and after bonding, removing the sacrificial structure to form a first cavity. According to the invention, the process flow is simplified, the process cost is reduced, and the measurement precision of the thermopile sensor is improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular to a method for manufacturing a thermopile sensor. Background technique [0002] A thermopile (thermal-pile) is an element that can convert temperature difference and electric energy into each other. It consists of two or more thermocouples connected in series. The thermoelectric potentials output by each thermocouple are superimposed on each other. When there is a temperature difference, an electric current is generated. Thermopile sensors can be equipped with various lenses and filters, so as to realize temperature measurement (forehead thermometer, ear thermometer, food temperature detection, etc.), qualitative / quantitative analysis of gas components, smart home appliances, lamp switches, medical equipment, etc. applications in various application scenarios. [0003] However, the device accuracy of existing thermopile sensors needs to be impr...

Claims

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Application Information

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IPC IPC(8): H01L35/34B81C1/00G01J5/12
CPCB81C1/00238B81C1/00047B81C1/0069B81C1/00301G01J5/12G01J2005/123H10N10/01Y02P70/50
Inventor 黄河
Owner NINGBO SEMICON INT CORP
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