Polishing grinding tool and preparation method thereof
A polishing grinding and grinding tool technology, which is applied in the direction of grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problem of not meeting the high-quality and high-precision grinding requirements, affecting the straightness and flatness of the frame, and affecting the processing accuracy and error range to achieve the effect of improving economical and practical performance, reducing shrinkage rate and improving competitiveness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0036]A polishing abrasive, comprising a grinding head 2 and a shank, one end of the shank portion 1 is provided with a pattern 11, and the grinding head 2 and the shank 1 along the same central axis, the grinding head 22, the two sets of resin abrasive layer disposed on the tread portion 11, the grinding head 2 comprises a resiliently deformable deformation of the rubber layer 21 and the coating 21 on the outer surface of the rubber layer of the elastomeric resin abrasive layer 22 may be made of abrasive layer material, a material comprising the following parts by weight of the abrasive layer material:
[0037]
[0038] Each of said filler is calcium silicate, the filler particle size is 3 m;
[0039] Each of the diamond abrasive, the abrasive particle size is 3 m;
[0040] The elastic deformation of the rubber layer 21 may be nitrile rubber, hardness of 40A.
[0041] Each of the silane coupling agent and defoamer additives in a weight ratio of 0.8: 0.6 mixture thereof.
[0042...
Embodiment 2
[0059] A polishing abrasive, comprising a grinding head 2 and a shank, one end of the shank portion 1 is provided with a pattern 11, and the grinding head 2 and the shank 1 along the same central axis, the grinding head 22, the two sets of resin abrasive layer disposed on the tread portion 11, the grinding head 2 comprises a resiliently deformable deformation of the rubber layer 21 and the coating 21 on the outer surface of the rubber layer of the elastomeric resin abrasive layer 22 may be made of abrasive layer material, a material comprising the following parts by weight of the abrasive layer material:
[0060]
[0061] Each of the magnesium oxide filler, the filler particle size is 9 m;
[0062] Each of the abrasive is alumina, the abrasive particle size of 9 m;
[0063] The resiliently deformable rubber layer 21 is prepared by coating a polysulfide rubber, a hardness of 43A.
[0064] Each said adjuvant is a silane coupling agent and an antifoaming agent 0.9 weight ratio: 0.7...
Embodiment 3
[0082] A polishing abrasive, comprising a grinding head 2 and a shank, one end of the shank portion 1 is provided with a pattern 11, and the grinding head 2 and the shank 1 along the same central axis, the grinding head 22, the two sets of resin abrasive layer disposed on the tread portion 11, the grinding head 2 comprises a resiliently deformable deformation of the rubber layer 21 and the coating 21 on the outer surface of the rubber layer of the elastomeric resin abrasive layer 22 may be made of abrasive layer material, a material comprising the following parts by weight of the abrasive layer material:
[0083]
[0084] Each of the zirconia filler, the filler particle size is 15 m;
[0085] Each of the abrasive is silicon carbide, the abrasive grain size of 15 m;
[0086] The resiliently deformable rubber layer 21 is a silicone rubber, a hardness of 45A.
[0087] Each said adjuvant is a silane coupling agent and an antifoaming agent 1.0 weight ratio: 0.8 mixture thereof.
[00...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com