Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device conducting composite manufacturing on basis of laser technology

A technology of laser technology and control device, which is applied in the field of composite manufacturing devices based on laser technology, can solve the problems of low geometric dimension accuracy, large residual tensile stress, and many internal defects of SLM forming parts, and achieve the goal of overcoming low forming accuracy, residual High compressive stress, improve anti-fatigue effect

Pending Publication Date: 2020-11-27
SHANGHAI UNIV OF ENG SCI
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of low geometric dimension accuracy, poor surface quality, large residual tensile stress and many internal defects of SLM forming parts in the prior art, and then provide a kind of manufacturing equipment that realizes high precision and integrated near-net shape

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device conducting composite manufacturing on basis of laser technology
  • Device conducting composite manufacturing on basis of laser technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings, taking the manufacture of a 316 stainless steel capillary as an example.

[0051] A device for compound manufacturing based on laser technology, such as figure 1 As shown, it includes a sealed molding room 2, an inert protective gas source 1, a processing molding platform 5, an optical path selection system 3, and a control device 7 (computer);

[0052] The inert protective gas source 1 is connected with the sealed forming chamber 2 to provide inert protective gas for the sealed forming chamber 2;

[0053] The processing forming platform 5 is arranged in the sealed forming chamber 2, wherein the optical path selection system 3 is arranged above the processing forming platform 5;

[0054] The processing and forming platform 5 includes a processing platform surface, a powder material cylinder 504, a forming cylinder 502 (that is, a processing position), ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
frequencyaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a device conducting composite manufacturing on the basis of a laser technology. The device comprises a sealed forming chamber, an inert protective gas source and a machining forming platform. The inert protective gas source is connected with the sealed forming chamber. The machining forming platform is arranged in the sealed forming chamber, and a light path selection system is arranged over the machining forming platform. A machining station is arranged on the machining forming platform, and the machining forming platform is arranged on a guide rail and can slide forwards and backwards through the guide rail. The light path selection system comprises a shock reinforcing independent laser light path, an additive independent laser light path and a subtractive independent laser light path. The light paths are arranged in the direction of the guide rail, and all the independent laser light paths do not share equipment and are arranged over the machining forming platform. According to the device, the laser shock reinforcing technology and the laser additive and subtractive technology are integrated, the forming precision, the surface quality, the organization performance and the residual stress state of a complex fine additive workpiece are improved, and one-stop high-efficiency high-precision and high-performance additive workpiece preparation is achieved.

Description

Technical field [0001] The invention belongs to the technical field of laser processing and relates to a device for compound manufacturing based on laser technology. Background technique [0002] Selective Laser Melting (SLM) is a laser additive manufacturing technology based on material discrete-gradual accumulation method to manufacture solid parts. It uses high-power laser as the heat source to melt metal powder layer by layer to directly manufacture Complicated and fine-structured parts (high processing accuracy). This technology can realize fast and moldless near-net molding of dense materials with complex structures. It provides new ideas for the integrated preparation of complex and fine-structured parts, especially for aerospace The molding of key precision parts in the fields of, medical equipment, precision machine tools, electronic communications and other fields provides a simple, fast, low-cost, green flexible manufacturing technology from powder to complete parts, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B22F3/24C21D10/00C22F3/00B23K26/064B23K26/36B33Y10/00B33Y30/00B33Y40/20
CPCB22F3/003B22F3/24C22F3/00C21D10/005B23K26/36B23K26/064B33Y10/00B33Y30/00B33Y40/20B22F2003/247Y02P10/25
Inventor 高双何博兰亮谭志俊张奇
Owner SHANGHAI UNIV OF ENG SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products