Modularly designed MEMS diffused silicon pressure sensor and manufacturing method thereof

Abstract

The invention provides a modularly designed MEMS diffused silicon pressure sensor. The modularly designed MEMS diffused silicon pressure sensor comprises a pressure input module, a pressure sensing module, a signal processing module and a signal output module. The pressure input module is responsible for inputting external pressure, and a cavity is formed in the center of the pressure input modulein the vertical direction. The pressure sensing module is responsible for sensing a pressure signal and is embedded into the upper part of the cavity. The signal processing module is responsible foramplifying, operating, shaping, compensating and calibrating the pressure signal, is arranged above the pressure sensing module and is in signal connection with the top end of the pressure sensing module. The signal output module is responsible for outputting pressure signals, is located above the signal processing module, wraps the signal processing module, is in signal connection with the top end of the signal processing module and is fixedly connected with the upper end of the pressure input module. The sensor has the beneficial effects that the complexity of the production process is effectively simplified through the modular design and manufacturing process, the cost of the production process is reduced, and the stability of the product quality and the production efficiency are improved.

Description

【Technical field】 [0001] The invention relates to a pressure sensor which adopts MEMS diffused silicon technology and modular manufacturing, including a pressure sensing module and a signal output module manufactured by injection molding and sealing, wherein the pressure sensing module includes a metal support body and a miniaturized metal glass sintered body , the miniaturized metal glass sintered body is embedded in the hole in the middle of the metal support, and the related pressure sensing device is installed on the bottom surface of the metal glass sintered body in the hole; the signal output module made by one-time injection molding integrates the metal shell, signal output Copper pins and plastic insulators meet IP67 product sealing protection requirements. The present invention also includes a manufacturing method related to this modular design MEMS diffused silicon pressure sensor. 【Background technique】 [0002] A pressure sensor is a device or device that can se...

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Problems solved by technology

[0011] The purpose of the present invention is to solve the following problems in the current mainstream pressure sensors on the market: the sealing ring is used for sealing, the aging speed is fast and air leakage is easy, resulting in failure failure; each component is manufactured separately, the manufacturing cost is high, and the manufacturing production efficiency is low; the production The process is cumbersome and complicated, and the product consistency is poor; the production process is difficult to control, and the product quality is low and the stability is poor; the process control of the diffused silicon induction core packaging technology is difficult, and the product accuracy is poor; the product size is large, and the installation takes up a lot of space; Design of MEMS diffused silicon pressure sensor and method of fabrication thereof

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