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Ceramic tile paving structure capable of reducing thermal expansion stress of cement and paving method thereof

A thermal expansion, ceramic tile technology, applied in building structure, floor, covering/lining, etc., can solve the problems of ceramic tile skipping, reducing decoration quality, decoration integrity and adverse aesthetic effects, etc., to prevent ceramic skipping and improve decoration. quality effect

Inactive Publication Date: 2020-11-20
清远市简一陶瓷有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, such wider gaps lead to adverse effects on the integrity and aesthetics of the decoration, reducing the quality of the decoration
In order to improve the decoration quality, it is necessary to reduce the width of the gap, but the narrowing of the width will lead to problems such as ceramic tiles bouncing and arching

Method used

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  • Ceramic tile paving structure capable of reducing thermal expansion stress of cement and paving method thereof
  • Ceramic tile paving structure capable of reducing thermal expansion stress of cement and paving method thereof

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Embodiment Construction

[0024] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0025] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying Describes, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate in a specific orientation, and therefore sh...

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Abstract

The invention relates to the technical field of ceramic tile paving. The invention discloses a ceramic tile paving structure capable of reducing thermal expansion stress of cement. The structure comprises a ceramic tile layer, a paving plane and a honeycomb structure, the honeycomb structure is arranged on the paving plane; holes of the honeycomb structure are formed in an upper and down opening mode, the holes of the honeycomb structure are filled with cement mortar, the bottom of the ceramic tile layer is arranged at the top of the honeycomb structure, the ceramic tile layer comprises a plurality of ceramic tiles, and the width of a gap between any two adjacent ceramic tiles is smaller than or equal to 0.5 mm. According to the ceramic tile paving structure capable of reducing the cementthermal expansion stress, the problems of ceramic tile jumping, arching and the like can be prevented while close joint paving is achieved, and the decoration quality is improved.

Description

technical field [0001] The invention relates to the technical field of tile laying, in particular to a tile laying structure and a laying method for reducing thermal expansion stress of cement. Background technique [0002] In traditional tile laying, the thermal expansion and cold contraction displacement of the cement layer is generally controlled by applying expansion joints around the cement layer and at the corners, and the seam paving process is adopted when laying tiles. But now more and more families choose to install floor heating. When the floor heating is heated, the expansion coefficient of the tiles is smaller than that of the cement layer. This leads to the need to leave a wider gap when laying tiles with seams, usually the width of the gap is 2mm, to avoid problems such as tile bounce and arching. [0003] However, such a wide gap causes adverse effects on the integrity and aesthetics of the decoration, and reduces the quality of the decoration. In order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02E04F15/08E04F15/18
CPCE04F15/0215E04F15/082E04F15/182E04F2290/023
Inventor 戴炜左凡朱联峰伍永归
Owner 清远市简一陶瓷有限公司
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