High-power LED module

A LED module, high-power technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as uneven temperature distribution, lower LED quality, LED chip aging, etc., to achieve the effect of improving light reflection effect

Inactive Publication Date: 2020-11-17
重庆同纳科技发展有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the prior art, the present invention provides a high-power LED module, which solves the problem of uneven temperature distribution around the substrate and premature aging or failure of some LED chips in the prior art. The problem of reducing the quality of the LED

Method used

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Embodiment Construction

[0024] The technical solutions of the present invention will be further described below in conjunction with the drawings and embodiments.

[0025] Such as Figure 1-2 As shown in a high-power LED module, a number of LED chips 4 are pasted on the front surface of a substrate 1 by silver glue. The farther the distance from the center of the substrate 1 is, the smaller the distance between the LED chips 4 is. The heat sink 3 is adhered to the back surface of the substrate 1 with an adhesive. The substrate 1 is made of copper to improve the heat dissipation capacity of the substrate 1. The base plate 1 is a spherical shell with flanges on the edges to facilitate the installation of the transparent cover 2. The center of the spherical shell is on the back side of the substrate 1, so that the front surface of the substrate 1 is the outer surface of the spherical shell, and the back of the substrate 1 is the inner surface of the spherical shell.

[0026] Such as image 3 , The transpar...

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Abstract

The invention provides a high-power LED module which comprises a substrate, a plurality of LED chips and a radiator. The LED chips are arranged on the front face of the substrate, the radiator is arranged on the back face of the substrate, and the substrate is a spherical shell. The center of the spherical shell is located at one side of the back face of the substrate, and a plurality of trapezoidal grooves are formed in the front face of the substrate. The trapezoidal grooves are arranged along the longitude direction of the spherical shell, the section of each trapezoidal groove is a trapezoid with an opening at the upper end, and the length of the opening at the upper end is larger than that of the bottom edge at the lower end. A transparent cover is arranged on the front face of the substrate, a closed inert gas space is formed by the transparent cover and the front face of the substrate, and the inert gas space is filled with helium. According to the invention, the temperature distribution of the front surface of the substrate is more uniform, and the quality of the LED is improved.

Description

Technical field [0001] The present invention relates to the technical field of LED lighting equipment, and in particular to a high-power LED module. Background technique [0002] LED is a new type of semiconductor solid light source, which has the advantages of strong safety and reliability, low power consumption, and high luminous efficiency. Like traditional light sources, LEDs also generate a lot of heat during use, especially high-power LEDs. Too high temperature will accelerate the aging of the chip and directly affect the service life and luminous efficiency of the LED. [0003] In order to solve the problem of LED heat dissipation, there are many technical solutions. Generally, the structure of the LED module is changed to make the substrate heat dissipation better. However, although these solutions enhance the heat dissipation of the substrate, the temperature distribution throughout the substrate Uneven, some LED chips are still in a high temperature state, and some LED c...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/64
CPCH01L25/0753H01L33/483H01L33/642
Inventor 杜聪
Owner 重庆同纳科技发展有限责任公司
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