Light-emitting diode packaging module
A technology for light-emitting diodes and packaging modules, which is applied in electrical components, electrical solid-state devices, circuits, etc., and can solve problems such as inability to achieve
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[0023] Its detailed description is as follows, and the preferred embodiment is only for illustration and not intended to limit the present invention. Figure 1A , Figure 1B and Figure 1C It is a schematic diagram of an LED packaging module according to an embodiment of the present invention.
[0024] In this example, if Figure 1A As shown, the LED packaging module includes a circuit board 10 . A metal plate 20 directly covers the entire upper surface of the circuit board 10 . The metal plate 20 has a plurality of chip carriers 22 and a plurality of openings 24 . The opening 24 exposes a wire bonding area on the upper surface of the circuit board 10 . The opening 24 is disposed adjacent to the chip carrier 22 .
[0025] Next, please refer to Figure 1B , a plurality of chips 30 are respectively arranged on each chip carrier 22 one by one. A plurality of wires (not shown in the figure) are electrically connected to the bonding area of the chip 30 and the circuit board...
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